Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler
Brand Name:Ziitek
Certification:UL
Model Number:TIF090-11
Minimum Order Quantity:1000tube
Delivery Time:3-8 WORK DAYS
Payment Terms:T/T
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Location:
Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times:
within 2 hours
Product Details
Company Profile
Product Details
Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler
TIF®090-11 is a soft silicone-based gap filler pad formulated with thermally conductive fillers and a unique compound that combines excellent themal performance with outstanding softness. Compared to conventional thermal grease,TIF®090-11 has a higher viscosity, effectively preventing the separation of fllers from the siliconebase. lt also offers more stable bond line control under pressure,enhancing product reliability. TIF®090-11 is applied similaty to traditional themal paste and is compatible with various commercial equipment,such as dispensing systems or automated production equipment. lt is suitable for a wide range of high-power electronic components and packaging formats, including flip-chip microprocessors (Flip-Chip MPU),PPGA, micro BGA,BGA,DSP chips, circular accelerator chips, and LED lighting modules.
Feature
> Thermal conductivity: 9.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability
Application
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler
> Telecom industry
> Semiconductor automatic laboratory equipment
| TIFTM090-11 Typical Property | ||
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicon material | ***** |
| Viscosity | 13000K mPa.s | GB/T 10247 |
| Specific Gravity | 3.45g/cm³ | ASTM D297 |
| Thermal conductivity | 9.0 W/mK | ASTM D5470 |
| Thermal resistance @10Psi(℃-in²/W) | 0.089 | ASTM D5470 |
| Thermal resistance @50Psi(℃-in²/W) | 0.055 | ASTM D5470 |
| Recommended Operating temp | -45~200℃ | ISO 22007-2 |
| Dielectric breakdown strength(V/mm) | ≥4000 | ISO 22007-2 |
| Bond line Thickness | 0.40 | ****** |
| D3-D10(Siloxane Content, ppm) | ＜100 | GC-MS |
| Flame Rating | V-0 | UL 94 |
Packing details
30 cc/pc, 98 pc/box;
300 cc/pc , 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Q&A
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .
Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler
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