Semiconductor Photoresist Ultrasonic Lithography Coating System
Brand Name:FUNSONIC
Certification:CE
Model Number:FS620
Minimum Order Quantity:1 UNIT
Payment Terms:T/T, Western Union
Place of Origin:CHINA
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Hangzhou Zhejiang China
Address:
No. 196 Shitashang Qiufeng Village, Fuchun Subdistrict, Fuyang District, Hangzhou City, Zhejiang Province, China. 311400
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Semiconductor Photoresist Ultrasonic Lithography Coating System
Description:
Ultrasonic spraying is a simple, economical, and reproducible
process for photoresist coating in photolithography wafer
processing. FUNSONIC's semiconductor photoresist ultrasonic
lithography coating system uses advanced layering technology to
finely control flow rate, coating speed, and deposition amount. Low
speed spray molding defines atomized spray as an accurate and
controllable pattern to avoid overspray and produce very thin and
uniform layers.
FUNSONIC's semiconductor photoresist ultrasonic lithography coating
system has advantages in depositing more uniform coatings,
especially along the top of the sidewalls of high aspect ratio
grooves and V-shaped groove structures. Centrifugal rotation cannot
deposit uniform coatings along the sidewalls, without accumulating
too much photoresist at the bottom of the cavity.
Parameters:
| Product Type | Ultrasonic Precision Spray Coating Machine Laboratory desktop Type FS310 | Intelligent Ultrasonic Precision Coating Machine desktop Type FS620 |
| Spray Nozzle Operating Frequency | 20-200KHz | 20-200KHz (Normally use 60100110120K) |
| Nozzle Power | 1-15W | 1-15W |
| Continuous Spraying Volume Max | 0.01-50ml/min | 0.01-50ml/min |
| Effective Spraying Width | 2-100mm | 2-100mm |
| Spray Uniformity | ≥95% | ≥95% |
| Solution Conversion Rate | ≥95% | ≥95% |
| Dry Film Thickness | 20nm-100μm | 20nm-100μm |
| Solution Viscosity | ≤30cps | ≤30cps |
| Temperature Range | 1-60℃ | 1-60℃ |
| Atomized Particles (Median Value) | 10-45μm (distilled water), determined by the frequency of the nozzle | 10-45μm (distilled water), determined by the frequency of the nozzle |
| Diversion Pressure Max | ≤0.10MPA | ≤0.15MPA |
| Input Voltage | 220V±10%/50-60Hz | 220V±10%/50-60Hz |
| Exercise Mode | X+Y two axis fully automatic, Z-axis manual adjustment | XYZ three-axis, independently programmable |
| Control Mode | Micro computer card, 7-inch touch screen+buttons | FUNSONIC spraying control system, PLC control, 13.3-inch full-color touch screen |
| Control Content | Ultrasonic spraying, liquid supply, heating, ultrasonic dispersion and other systems | Ultrasonic spraying, liquid supply, heating, ultrasonic dispersion and other systems |
| Liquid Supply Method | Precision injection pump | Precision injection pump |
| Ultrasonic Dispersion System (Optional) | 50ml, 40K, biological grade sampler | 20ml or 50ml, 40K, biological grade sampler |
| Rated Power of Ultrasonic Dispersion System | 200W,10A | 100W |
Advantages:
1. Uniform film coverage of various surface contours.
2. Able to coat high aspect ratio grooves with excellent
uniformity.
3. Non clogging atomizing spray.
4. Capable of depositing highly uniform single micron thin layers.
5. Repeatable mature spraying process.
Semiconductor Photoresist Ultrasonic Lithography Coating System
Semiconductor Photoresist Ultrasonic Lithography Coating System
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