Product Details
Round Ceramic Chuck Tables Porous Chuck Table for Japanese, German and
Chinese dicing saws
Our porous ceramic and metal chuck table is a specially designed
tool for water absorption and holding purposed during the
production of semiconductor wafers. It is mainly used in back
grinding and dicing processes. The back grinding chuck tables and
dicing chuck tables work well with Japanese, German and Chinese
dicing saws and back grinding machines, thus ensuring an excellent
cost effectiveness.
Features
1. This wafer chuck provides a high flatness and depth of
parallelism.
2. It is compact in structure, uniform size and high strength.
3. It features a well-distributed absorption capacity.
4. The dicing accessory is easy to dress.
Applications
2, 3, 4, 5, 6, 8 and 12 inch semiconductor wafers
Applicable Machines
Back grinding machines, dicing saws
Type
Ceramic,Metal
Company Profile
Zhengzhou Hongtuo Superabrasive Tools Co.,Ltd was founded in
1997.It is a high-tech company engaged in R&D,production,sale
and service of superabrasive tools.The company has 350
employees,over 300 sets of manufacturing and testing
equipments.With 2 advanced metal bonded honing stones and vitrified
bonded diamond&CBN grinding wheels production lines,which can
produce750 000 pieces honing stones and 4 000 pieces grinding
wheels annually.The company has been granted the ISO9001:2000
certificate in 2000.In the same year,it has been obtained the
certificate of “high-new technology company”and “high-new
technology products”granted by Science&Technology Division of
Henan province.
Our products are widely used in the such industries as:automobile
parts,motor parts,refrigeration
compressor,aviation,hydraulics,sewing-machine parts and bearings.In
respect of product quality,development and production capacity,the
company is a leading manufacturer in the industry.it can meet all
kinds of requirement.At present,a great parts of our proucts are
sold to countries and regions as Europe,Japan,Taiwan and South-East
Asian countries.
Our customer