Uniform Size Ceramic Chuck Table , 8'' Compact Structure Metal Chuck Table

Brand Name:HT
Certification:ISO9001:2015
Model Number:HT-CT
Minimum Order Quantity:2
Delivery Time:2-3weeks
Payment Terms:T/C,T/T
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Location: Zhengzhou Henan China
Address: 176#, The 7th Street, Economic & Technological Development Area. 450016, Zhengzhou, China
Supplier`s last login times: within 15 hours
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Product Details

Round Ceramic Chuck Tables Porous Chuck Table for Japanese, German and Chinese dicing saws


Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and dicing chuck tables work well with Japanese, German and Chinese dicing saws and back grinding machines, thus ensuring an excellent cost effectiveness.


Features


1. This wafer chuck provides a high flatness and depth of parallelism.

2. It is compact in structure, uniform size and high strength.

3. It features a well-distributed absorption capacity.

4. The dicing accessory is easy to dress.


Applications


2, 3, 4, 5, 6, 8 and 12 inch semiconductor wafers


Applicable Machines


Back grinding machines, dicing saws


Type


Ceramic,Metal


China Uniform Size Ceramic Chuck Table , 8'' Compact Structure Metal Chuck Table supplier

Uniform Size Ceramic Chuck Table , 8'' Compact Structure Metal Chuck Table

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