SMT Stencil For PCB Assembly Solder Paste Laser Profile with 0.1mm stainless steel foil

Brand Name:Bicheng Enterprise Limited
Certification:UL
Model Number:BIC-0427-V4.27
Minimum Order Quantity:1
Delivery Time:2-3 working days
Payment Terms:T/T/Paypal
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Location: Shenzhen Guangdong China
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Supplier`s last login times: within 1 hours
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1.1 General description


This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless

steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated

per IPC 7525A using supplied Gerber data, squeegee area locating in the center.

Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK

carton (hard card) and usually 2 stencils are packed for shipment.


1.2 Features and benifits


A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process

error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to

the printing and forming of tin paste;
D. Engineering design prevents problems from occurring in pre production;
E. Money-saving, Worry-saving and Labor-saving;
F. Door to door shipment service;
G. More than 9000 types per month;
H. No minimum order quantity. 1 piece is available;



1.3 Application


SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.


1.4 Parameter and data sheet

Dimension:370mm x 470mm, 420mm x 520mm, 550mm x 650mm
StructureStencil foils with aluminum frame
Base materialStainless steel shim
Foil Thickness

0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm,

0.15mm, 0.18mm, 0.2mm

Aperture configuredLaser cut
AppearanceEngraving and electro polishing
Fiducial markThrough hole
Service area:Worldwide
Quantity of open pads:1533
Advantages:

a) High precision dimension; b) Good shape on the window;

c) Hole wall is smoother.

Application:CSP, BGA, 0.5mm QFP etc. package

1.5 Opening Hole Design for Stencil

Component

Type

PitchSoldering WidthSoldering LengthOpening WidthOpening LengthShim Thickness
PLCC1.27mm0.65mm2.00mm0.60mm1.95mm0.15-0.25mm
QFP0.635mm0.35mm1.50mm0.32mm1.45mm0.15-0.18mm
QFP0.50mm0.254-0.33mm1.25mm0.22-0.25mm1.20mm0.12-0.15mm
QFP0.40mm0.25mm1.25mm0.20mm1.20mm0.10-0.12mm
QFP0.30mm0.20mm1.00mm0.15mm0.95mm0.07-0.12mm
04020.50mm0.65mm0.45mm0.60mm0.12-0.15mm
02010.25mm0.40mm0.23mm0.35mm0.07-0.12mm
BGA1.27mm0.80mm0.75mm0.75mm0.15-0.20mm
BGA1.00mm0.38mm0.35mm0.35mm0.10-0.12mm
BGA0.50mm0.30mm0.28mm0.28mm0.07-0.12mm
Flip Chip0.25mm0.12mm0.12mm0.12mm0.12mm0.08-0.10mm
Flip Chip0.20mm0.10mm0.10mm0.10mm0.10mm0.05-0.10mm

China SMT Stencil For PCB Assembly Solder Paste Laser Profile with 0.1mm stainless steel foil supplier

SMT Stencil For PCB Assembly Solder Paste Laser Profile with 0.1mm stainless steel foil

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