F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion Silver
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F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion Silver
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello everybody,
Today we talk about a type of F4BTME high frequency circuit board - F4BTME300 PCB.
This PCB features a size of 170 mm x 95 mm and is designed as a double-sided board with two layers. It supports surface mount components, while through-hole components are not included in this design. The layer stackup consists of a top layer with 35 µm (1 oz) copper starting with 0.5oz plating, paired with a core material of F4BTME300 that is 3.0 mm thick. The bottom layer also comprises 35 µm (1 oz) copper with plating. This PCB uses immersion silver, providing excellent solderability and protection. Notably, there is no solder mask applied to this board, allowing for direct access to the copper layers.
PCB Specifications
| PCB SIZE | 170 x 95mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 35um(0.5 oz+plate )TOP layer |
| F4BTME300 -3.0mm | |
| copper ------- 35um(0.5 oz + plate) BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 7 mil / 7 mil |
| Minimum / Maximum Holes: | 0.5 mm / 0.6 mm |
| Number of Different Holes: | 5 |
| Number of Drill Holes: | 16 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 2 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | F4BTME300 DK 3.0 |
| Final foil external: | 1oz |
| Final foil internal: | N/A |
| Final height of PCB: | 3.1 mm ±10% |
| PLATING AND COATING | |
| Surface Finish | Immersion silver |
| Solder Mask Apply To: | no |
| Solder Mask Color: | no |
| Solder Mask Type: | no |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Non-Plated through hole(PTH), minimum size 0.5mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
The basic color of F4BTME300 PCB is brown.
F4BTME High Frequency Laminates
The F4BTME series laminates are manufactured through a meticulous process that involves the scientific formulation of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin.
These substrates are built upon the F4BM dielectric layer and incorporate high dielectric constant and low loss nano-ceramics. This integration results in enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.
Furthermore, F4BTME laminates are specifically paired with reverse-treated RTF copper foil, providing exceptional performance in terms of PIM, precise line control, and minimized conductor loss.
The dielectric constant ranges from 2.98 to 3.5 and ED Copper foil available with 0.5oz, 1oz, 1.5oz and 2oz, RTF copper available with 0.5oz and 1oz; thickness available of from 0.254mm to 12.0mm.
Data Sheet (F4BTME300)
| Product Technical Parameters | Product Models & Data Sheet | ||||||
| Product Features | Test Conditions | Unit | F4BTME298 | F4BTME300 | F4BTME320 | F4BTME350 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.98 | 3.0 | 3.2 | 3.5 | |
| Dielectric Constant Tolerance | / | / | ±0.06 | ±0.06 | ±0.06 | ±0.07 | |
| Loss Tangent (Typical) | 10GHz | / | 0.0018 | 0.0018 | 0.0020 | 0.0025 | |
| 20GHz | / | 0.0023 | 0.0023 | 0.0026 | 0.0035 | ||
| Dielectric Constant Temperature Coefficient | -55 º~150ºC | PPM/℃ | -78 | -75 | -75 | -60 | |
| Peel Strength | 1 OZ F4BTM | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | |
| 1 OZ F4BTME | N/mm | >1.4 | >1.4 | >1.4 | >1.4 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥1×10^7 | ≥1×10^7 | ≥1×10^7 | ≥1×10^7 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >26 | >30 | >32 | >32 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >34 | >35 | >40 | >40 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 15,16 | 15,16 | 13,15 | 10,12 |
| Z direction | -55 º~288ºC | ppm/ºC | 78 | 72 | 58 | 51 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.05 | ≤0.05 | ≤0.05 | ≤0.05 | |
| Density | Room Temperature | g/cm3 | 2.25 | 2.25 | 2.20 | 2.20 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.42 | 0.42 | 0.50 | 0.54 | |
| PIM | Only applicable to F4BTME | dBc | ≤-160 | ≤-160 | ≤-160 | ≤-160 | |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth, nano-ceramics F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil. | ||||
F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion Silver
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