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Elevate Your High-Freq Designs with Bicheng's Cutting-Edge PCB Hybrid
In the world of high-frequency electronics, the choice of PCB materials can make or break your design. That's why the team at Bicheng has engineered a game-changing hybrid PCB solution, blending the best of Rogers RO3003 and S1000-2M FR-4 substrates.
Say goodbye to compromises. This unparalleled PCB stackup delivers unrivaled performance across a wide temperature range, empowering you to push the boundaries of what's possible.
Uncompromising High-Freq Performance
The secret lies in the synergistic combination of materials. The
RO3003 core provides the low-loss, low-CTE foundation critical for
high-frequency circuitry, with a dielectric constant of 3.0 ± 0.04
at 10 GHz and a jaw-dropping dissipation factor of just 0.001.
Paired with the robust S1000-2M FR-4 build-up layers, you get the best of both worlds - precision high-frequency performance and the flexibility to integrate active and passive components.
Engineered for Reliability
But it's not just about raw performance. Bicheng has meticulously
engineered this hybrid stackup to deliver rock-solid reliability,
even in the most demanding environments.
Coefficients of thermal expansion as low as 17/16/25 ppm/°C ensure your critical circuits stay stable, even as temperatures fluctuate from -40°C to +85°C. And with features like blind vias, 0.5 oz inner and 1 oz outer copper weights, and an immersion gold finish, you can trust this PCB to perform flawlessly.
Unlock Your Design Potential
Whether you're tackling band pass filters, patch antennas, VCOs, or
any other high-frequency challenge, Bicheng's RO3003 + S1000-2M
hybrid PCBs are designed to be your secret weapon.
Leverage the uncompromising performance and reliability of this cutting-edge solution, and take your designs to new heights. Contact us today to unlock the full potential of your high-frequency innovations.