Specialized Equipment For Transparent Glue Inspection SMT Equipment AOI

Brand Name:KINGFEI
Model Number:AOI
Minimum Order Quantity:1pcs
Delivery Time:within 1~5days
Payment Terms:T/T, Western Union, MoneyGram
Place of Origin:China
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Verified Supplier
Location: Shenzhen Guangdong China
Address: BuildingA, Jiepeng Square,Fuyong,Shenzhen, Guangdong,China
Supplier`s last login times: within 28 hours
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Specialized equipment for transparent glue inspection SMT Equipment AOI


Method for detecting underfill on devices
A:Chip thickness Excessive glue layer height::
B:Excessive glue layer height
Min:Should not be lower than the bottom
Max:Should not exceed the upper surface of the chip
Recommended height is 2/3 of the chip height

Glue filling quantity.
The smaller wide-spacing of CSP the higher filling arc required The large the wide-spacing of csp,the smaller filling arc required


Sample Detection information
1.UV 3D imaging technology fully displaying 3D infrmation of UV glue,analyzing the,analyzing the profile finding inflcting points based on the transformation rate,analysing neighboring information,locating the climbing glue position and controlling the specific the information of climbing glue
2.Precision measurement of trasparent glue height

China Specialized Equipment For Transparent Glue Inspection SMT Equipment AOI supplier

Specialized Equipment For Transparent Glue Inspection SMT Equipment AOI

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