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Infineon XENSIV™ MEMS Microphones are designed for applications requiring low self-noise (high SNR), wide dynamic range, below 1% distortions at 128dBSPL, and a high acoustic overload point. The microphones have a 70dB signal-to-noise ratio (SNR). The XENSIV™ MEMS Microphones offer crystal clear audio signals, extended pick-up distance, and sensitivity to both soft and loud signals in applications.
The microphones feature Dual Backplate MEMS technology, based on a miniaturized symmetrical microphone design, as utilized in studio condenser microphones. This results in high linearity of the output signal within a dynamic range of 95dB for the IM69D120 and 105dB for the IM69D130. This is combined with an exceptionally low distortion level of 10 percent at a 130dB sound pressure level (SPL).
The microphone distortion does not exceed 1%, even at sound pressure levels of 128dBSPL. The flat frequency response (28Hz low-frequency roll-off) and tight manufacturing tolerance result in close phase matching of the microphones, which is important for multi-microphone (array) applications. The microphones are housed in 4.0mm x 3.0mm x 1.2mm MEMS packages and are suited for high-quality acoustic recordings and far-field voice capturing applications.