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Product Technical Specifications | |
EU RoHS | Compliant聽 |
ECCN (US) | EAR99 |
Part Status | Obsolete |
HTS | 8542.39.00.01 |
Automotive | Yes |
PPAP | Unknown |
Driver Type | High and Low Side |
Driver Configuration | Non-Inverting |
Number of Drivers | 2 |
High and Low Sides Dependency | Independent |
Type | IGBT|MOSFET |
Number of Outputs | 2 |
Maximum Rise Time (ns) | 40 |
Maximum Fall Time (ns) | 30 |
Maximum Propagation Delay Time (ns) | 230 |
Input Logic Compatibility | CMOS|LSTTL |
Minimum Operating Supply Voltage (V) | 10 |
Maximum Operating Supply Voltage (V) | 20 |
Typical Input Low Threshold Voltage (V) | 6(Max) |
Typical Input High Threshold Voltage (V) | 9.5(Min) |
Maximum Power Dissipation (mW) | 1250 |
Minimum Operating Temperature (掳C) | -40 |
Maximum Operating Temperature (掳C) | 125 |
Supplier Temperature Grade | Automotive |
Special Features | Under Voltage Lockout |
Maximum Turn-On Delay Time (ns) | 35 |
Maximum Turn-Off Delay Time (ns) | 35 |
Packaging | Tape and Reel |
Mounting | Surface Mount |
Package Height | 2.35(Max) |
Package Width | 7.6(Max) |
Package Length | 10.5(Max) |
PCB changed | 16 |
Standard Package Name | SO |
Supplier Package | SOIC W |
Pin Count | 16 |
Lead Shape | Gull-wing |