MEMS Gyro Chips Fiber Optic Gyro PCB for High Precision Navigation

Brand Name:Firepower
Model Number:MGZ221HC
Minimum Order Quantity:1
Delivery Time:7 days for sample
Payment Terms:T/T
Place of Origin:china
Contact Now

Add to Cart

Verified Supplier
Location: Shenzhen Guangdong China
Address: 429, Building A10, Fuhai Information Port, Xinhe Community, Fuhai Street, Shenzhen, Guangdong, China
Supplier`s last login times: within 22 hours
Product Details Company Profile
Product Details

MEMS Gyro Chips Fiber Optic Gyro PCB for High Precision Navigation


PCB design:

The decoupling capacitors for pins VCP, VREF, VBUF, and VREG should be placed as close to the pins as possible, and the equivalent resistance of the traces should be minimized.  The other ends of the decoupling capacitors for VREF, VBUF, and VREG are connected to the nearest AVSS _ LN and then to signal ground via a magnetic bead.  The decoupling capacitors for VCC and VIO are also placed close to the corresponding pins. When VCC is in normal operation, the overall current will be about 35 mA, which requires a wide PCB trace to ensure voltage stability.  For smooth assembly of the device, try to avoid routing under the package.  Locate components to avoid areas of stress concentration. It is necessary to avoid large heat dissipation elements and areas with external mechanical contact, extrusion and pulling, as well as areas where positioning screws are prone to warping during overall installation.



About product

performance MGZ332HC-P1MGZ332HC-P5MGZ318HC-A1MGZ221HC-A4MGZ330HC-O1MGZ330HC-A1
Rangedeg/s400400400400400100
Band Width @3DB customized)Hz9018020020030050
Output accuracy(digital SPI)bits242424242424
Output rate(ODR)(customized)Hz12K12K12K12K12K12K
Delay(customized)ms<3<1.5<1.5<1.5<1<6
Bias stabilitydeg/hr(1o)<0.05<0.05<0.1<0.5<0.1<0.02
Bias stability (1σ 10s)deg/hr(1o)<0.5<0.5<1<5<1<0.1
Bias stability (1σ 1s)deg/hr(1o)<1.5<1.5<3<15<3<0.3
Bias error over temperature (1σ)deg/hr(1o)<5<5<10<30105
Bias temperature variations, calibrated(1σ)deg/hr(1o)<0.5<0.5<1<10<1<0.5
Bias repeatabilitydeg/hr(1o)<0.5<0.5<0.5<3<0.3<0.1
Scale factor at 25°Clsb/deg/s200002000016000160002000080000
Scale factor repeatability (1σ)ppm(1o)<20ppm<20ppm<20ppm<20ppm<100ppm<100ppm
Scale factor vs temperature (1σ)ppm(1o)100ppm100ppm<100ppm<100ppm<300ppm<300ppm
Scale factor non-linearity (1σ)ppm100ppm100ppm<150ppm<150ppm<300ppm<300ppm
Angular random walk(ARW)°/√h<0.025<0.025<0.05<0.25<0.05<0.005
Noise(Peak to Peak)deg/s<0.15<0.3<0.35<0.4<0.25<0.015
GValue sensitivity°/hr/g<1<1<1<3<1<1
Vibration rectification error(12gRMS,20-2000)°/hr/g(rms)<1<1<1<3<1<1
Power-on time (valid data)s750m
Sensor Resonant Frequencyhz10.5k-13.5K
Environmental suitability 
Impact (power on)500g , 1ms
Impact resistance (power off)10000g , 10ms
vibration(power on)18g rms (20Hz to 2kHz)
Working temperature-40℃----+85℃
Store temperature-55℃----+125℃
Supply voltage5±0.25V
Current consumption45ma


Installation


High-performance MEMS gyroscope is a high-precision test equipment. In order to achieve the best effect of design, it is recommended to consider the following aspects when installing the device on the PCB board: 1. In order to evaluate and optimize the placement of the sensor on the PCB, it is recommended to consider the following aspects and use additional tools during the design phase:  On the thermal side;  For mechanical stress: bending measurement and/or finite element simulation;  Robustness to impact: After the PCB of the target application has been soldered in the recommended manner, a drop test is performed. 2. It is recommended to maintain a reasonable distance between the mounting position of the sensor on the PCB and the key points described below (the exact value of "reasonable distance" depends on many customer-specific variables and must therefore be determined on a case-by-case basis):  It is generally recommended to keep the PCB thickness to a minimum (recommended: 1.6 ~ 2.0 mm), because the inherent stress of a thin PCB board is small;  It is not recommended to place the sensor directly under the button or close to the button because of mechanical stress;  It is not recommended to place the sensor near a very hot spot, such as a controller or graphics chip, as this can heat the PCB board and cause the temperature of the sensor to rise.

China MEMS Gyro Chips Fiber Optic Gyro PCB for High Precision Navigation supplier

MEMS Gyro Chips Fiber Optic Gyro PCB for High Precision Navigation

Inquiry Cart 0