Product Details
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FPC PRODUCTION CAPABILITY | | |
Item | Content | Regular Capability | Special |
1 | Layer | 1-6L | Above 8L |
2 | Max.Array Size | 500*600mm | 250*1500mm |
3 | Min.board Size | 1-*1mm | |
4 | Max.board thickness | 0.23mm | 0.4mm |
5 | Min.board thickness | 0.075mm | 0.065mm |
6 | (0.075mm≤T Tolerance±0.03mm | V | 575 |
7 | (0.035mm≤T Tolerance±0.05mm | ℃ | 130 |
8 | (0.6mm≤T Tolerance±0.1mm | %(50-260℃) | 0.5 |
9 | Max Drill bit Diameter | 6.5mm | |
10 | Min Drill bit Diameter | 0.20mm | 0.15mm |
11 | Routing tolerance | ±0.2mm | ±0.15mm |
12 | Min Base Copper | 1/3 OZ | 1/4 OZ |
13 | Max Base Copper | 2 OZ | 4 OZ |
14 | Min Coverlay Thickness | 1mil(PI0.5mil Adhesive 0.5mil) | |
15 | Max Coverlay Thickness | 2mil(PI1mil Adhesive 1mil) | |
16 | Tolerance of holes diameter(PTH) | ±0.05mm | |
17 | Tolerance of holes diameter(NPTH) | ±0.025mm | |
18 | Hole Position Deviation(hole to hole compared with the CAD data) | ±0.05mm | |
19 | Hole Position Deviation(copper foil to hole compared with the CAD data) | ±0.07mm | |
20 | PTH wall copper thickness | 12-18um | |
21 | Minimum Trace Width/Space | 1/3OZ Cu 1L 50/60um 1/2OZ 2L 70/80um 1OZ Cu 1L 70/80um 1OZ Cu 2L 80/90um | |
22 | Min distance copper foil to the edge | ±0.10mm | ±0.07mm |
23 | Offset tolerance of silk character | ±0.3mm | ±0.2mm |
24 | Soldermask printing offset tolerance | Photo sensitive:±0.1mm(±4mil) Printed backing:±0.3mm(±8mil) | ±0.075mm ±0.2mm |
25 | Soldermask thickness | Photo sensitive:0.007-0.02mm(0.3-0.8mil) Printed backing:0.01-0.025mm(0.4-1mil) | |
26 | Protective film alignment accuracy(joint offset tolerance) | ±0.15mm | ±0.10mm |
27 | Min protective film lamination spilled glue amount | 0.5mil Adhesive≤0.1mm(4mil) 1mil Adhesive≤0.15mm(6mil) | |
28 | Tin thickness(Max),(Min)/Tolerance | (0.2mil)-(2.0mil)±0.30mm | |
29 | Gold plating, Ni thickness(Gold finger or other parts) | 1-6 u inch | Min 30 u inch Max 280 u inch |
30 | Gold plating, Au thickness(Gold finger or other parts) | 1-6u inch | 1-10 u inch |
31 | ENIG Ni/Au thickness(Gold finger or other parts) | Ni:30-150u inch Au:±1u inch | 4 u inch |
32 | (OSP) | 0.2-0.8um | |
33 | Die Punching Min hole/tolerance | Min:0.5mm/±0.05mm | +0.06/-0mm |
34 | Alignment tolerance of manual joint operation | ±0.30mm | ±0.2 |
35 | Alignment tolerance of fixture joint operation | ±0.15mm | |
About HighLeap Electronic
Advantages of HighLeap Electronic
Company Profile
Highleap is a professional and reliable one-stop PCB solutions
provider for customers.HighLeap is responsible for overseas
business development.With high quality and on-time delivery
products we won the market's wide acclaim. We will continue to
focus on customer satisfaction, along with "high quality “and "fast
delivery", we will become a PCB service provider worthy of customer
trust.

Our products include pcb,pcb assembly,components,Keyboard pcb
design,Rigid-Flex PCB,FPC.,etc. To meet customers' various demand.
Our products are widely used in communication, medical equipment,
industrial control, power supply, consumer electronics and
aerospace, automobile industry,etc.All our products follow IPC
class and are approved by UL, ROHS and ISO9001. Also our executives
and technicians are experienced people who have been engaged in PCB
industry for more than twenty years so we have rich production
management experience and professional PCB skills.


We ensure the quality of PCB products by continuously introducing
new equipment’s and new technologies and using high quality
materials .With professional technicians we can provide early
design consultation and technical support, so that customers can be
more worry-free. With qualified and reliable products, advanced
technology and value-added service, we won the trusts and supports
of customers and established a good reputation in the industry.Our
goal is to be the leading PCB solutions provider in the electronics
industry with first-class products and services. We are devoted to
be a trusted partner of our customers.
