Fast PCB Factory Custom Design Fast Lead Time Flexible Circuit Board Flexible PCB Manufacturer

Brand Name:HighLeap
Certification:ISO9001/Iso14001/CE/ROHS
Model Number:Flex Pcb
Minimum Order Quantity:1pcs
Delivery Time:1-15 working days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
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Active Member
Location: Guangzhou China
Address: Room 1306, building 2, No. 96, Lixin 12 road, Xintang Town, Zengcheng District, Guangzhou
Supplier`s last login times: within 42 hours
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Product Details

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FPC PRODUCTION CAPABILITY
Item
Content
Regular Capability
Special
1
Layer
1-6L
Above 8L
2
Max.Array Size
500*600mm
250*1500mm
3
Min.board Size
1-*1mm
4
Max.board thickness
0.23mm
0.4mm
5
Min.board thickness
0.075mm
0.065mm
6
(0.075mm≤T Tolerance±0.03mm
V
575
7
(0.035mm≤T Tolerance±0.05mm
130
8
(0.6mm≤T Tolerance±0.1mm
%(50-260℃)
0.5
9
Max Drill bit Diameter
6.5mm
10
Min Drill bit Diameter
0.20mm
0.15mm
11
Routing tolerance
±0.2mm
±0.15mm
12
Min Base Copper
1/3 OZ
1/4 OZ
13
Max Base Copper
2 OZ
4 OZ
14
Min Coverlay Thickness
1mil(PI0.5mil Adhesive 0.5mil)
15
Max Coverlay Thickness
2mil(PI1mil Adhesive 1mil)
16
Tolerance of holes diameter(PTH)
±0.05mm
17
Tolerance of holes diameter(NPTH)
±0.025mm
18
Hole Position Deviation(hole to hole compared with the CAD data)
±0.05mm
19
Hole Position Deviation(copper foil to hole compared with the CAD data)
±0.07mm
20
PTH wall copper thickness
12-18um
21
Minimum Trace Width/Space
1/3OZ Cu 1L 50/60um 1/2OZ 2L 70/80um 1OZ Cu 1L 70/80um 1OZ Cu 2L 80/90um
22
Min distance copper foil to the edge
±0.10mm
±0.07mm
23
Offset tolerance of silk character
±0.3mm
±0.2mm
24
Soldermask printing offset tolerance
Photo sensitive:±0.1mm(±4mil) Printed backing:±0.3mm(±8mil)
±0.075mm ±0.2mm
25
Soldermask thickness
Photo sensitive:0.007-0.02mm(0.3-0.8mil) Printed backing:0.01-0.025mm(0.4-1mil)
26
Protective film alignment accuracy(joint offset tolerance)
±0.15mm
±0.10mm
27
Min protective film lamination spilled glue amount
0.5mil Adhesive≤0.1mm(4mil) 1mil Adhesive≤0.15mm(6mil)
28
Tin thickness(Max),(Min)/Tolerance
(0.2mil)-(2.0mil)±0.30mm
29
Gold plating, Ni thickness(Gold finger or other parts)
1-6 u inch
Min 30 u inch Max 280 u inch
30
Gold plating, Au thickness(Gold finger or other parts)
1-6u inch
1-10 u inch
31
ENIG Ni/Au thickness(Gold finger or other parts)
Ni:30-150u inch Au:±1u inch
4 u inch
32
(OSP)
0.2-0.8um
33
Die Punching Min hole/tolerance
Min:0.5mm/±0.05mm
+0.06/-0mm
34
Alignment tolerance of manual joint operation
±0.30mm
±0.2
35
Alignment tolerance of fixture joint operation
±0.15mm
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