TIE280-12AB Thermal Conductive Glue Electronic High Thermal Conductive Potting Epoxy Resin Adhesive

Brand Name:Ziitek
Certification:UL and RoHs
Model Number:TIE280-12AB
Minimum Order Quantity:5kg
Delivery Time:3-5 work days
Payment Terms:T/T
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Address: Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

TIE280-12AB Thermal Conductive Glue Electronic High Thermal Conductive Potting Epoxy Resin Adhesive


Product Summary:


TIE™ 280-12AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.

Features


> Good thermal conductive: 1.2W/mK

> Excellent insulation and smoothly sourface.

> Low shrinkage

> Low viscosity, expediting air releaseed.

> Excellent in solvents and water proof.

> Longer life time.

> Excellent thermal shock efficiecy and impact resistance


Application


> Automotive starters potting; General potting Thermal detector potting

> Ferrite adhesion; TIP type LED; Good adhesion to aromatic polyester

> Relay sealant; Good adhesion to rubber, ceramics PCB and plastics

> Power transformers and coils; Potting capacitors Potting of small electrical devices

> Adhesion to metal glass and plastic LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant

> Optical / medical component adhesive


Typical Properties of TIE280-12AB Series
Typical Uncured Material
TIETM280-12A(Resin)Mixing ratio (weight ratio)
A:=1 :1
ColorBlack
Viscosity @25℃ Brookfield15000 cPsViscosity @25℃ Brookfield10000 cPs
Operating time (@25℃)45 mins
Shelf life @25℃ in sealed12 monthsspecific Gravity1.6 g/cc
Mixture ColorBlack
TIE280-12B(Hardener)Cure Schedule
ColorBlackCure at 25C3 hrs
Viscosity @25℃ Brookfield7000 cPs
Shelf life @25℃ in sealed container12 monthsCure at 7o°c30 mins
Cured Properties
Hardness @25℃85 Shore D
Operating temperature-40℃ ~160℃
Glass transition temperature Tg92℃
Rate of tension0.10%
Coefficient of thermal expansion, /℃3.0x 10^(-5)
Fire resistance uL94 V-0
Moisture absorption % wt gain 24 hours water immersion @25℃<0.1%
Thermal Conductivity1.2 W/m-K
Dielectric Breakdown Voltage300 volts / mil
Dielectric Constant@1MHz4.2
volume resistivity, ohm-cm @ 25℃3.0x 10^13

Product packaging


1KG A/B for each tank.

5KG A/B each.

10KG A/B each.

Company profile


Vietnam Ziitek Technology Company Limited is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


FAQ:


Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.


Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.


Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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TIE280-12AB Thermal Conductive Glue Electronic High Thermal Conductive Potting Epoxy Resin Adhesive

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