TIF035-05 Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat
Brand Name:Ziitek
Certification:RoHS
Model Number:TIF035-05
Minimum Order Quantity:1000tube
Delivery Time:3-5 work days
Payment Terms:T/T
Contact Now
Add to Cart
Verified Supplier
Address:
Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
Supplier`s last login times:
within 1 hours
Product Details
Company Profile
Product Details
Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat
TIF035-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF035-05 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF035-05 operation mold is simliar as grease ,such as silkprint and screen
print or automatic injected facility. TIF035-05 can be applied on
chip micro processor,PPGAs,Micro BGA package,BGA package,DSP
chip,LED lighting and other high power electric component.
Feature
> Thermal conductivity: 3.5W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
Application
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
| TIFTM035-05 Typical Properties | ||
| Property | Value | Test method |
| Color | blue | Visual |
| Construction & Composition | Ceramic filled silicon material | ***** |
| Viscosity | 2000K mPa.s | GB/T 10247 |
| Density | 3.2g/cm³ | ASTM D297 |
| Thermal conductivity | 3.5W/mK | ASTM D5470 |
| Thermal diffusivity | 1.1073 mm²/s | ISO 22007-2 |
| Specific heat capacity | 3.3 MJ/m3K | ISO 22007-2 |
| Continuous Use Temperature | -45 ~200°C | Ziitek Test Method |
| Dielectric breakdown strength | 200 V/mil | ASTM D149 |
| Outgassing(TML) | 0.80% | ASTM E595 |
| Flame Rating | 94V0 | UL E331100 |
Packing details
30 cc/pc, 98 pc/box;
300 cc/pc , 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us
4. We will reply you as soon as possible with Email or online
Q&A
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
TIF035-05 Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat
Inquiry Cart
0