TIF200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer

Brand Name:Ziitek
Certification:RoHS
Model Number:TIF200-10-02S
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Address: Plot CN4, Ming Lang Industrial Cluster, Vu Thu distric, Thai Binh Province, Vietnam
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Product Details Company Profile
Product Details

TIF200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer


Product descriptions


TlF200-10-02s Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to themetal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features

> Good thermal conductive 1.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available


Application

> Mainboard/mother board
> Notebook
> Power supply
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

Typical Properties of TIFTIM200-10-02S Series
PropertyValueTest method
ColorPink/White*****
Construction &CompostionCeramic filled silicone elastomer*****
Specific Gravity1.9g/ccASTM D297
Thickness range0.020"~0.250"ASTM D374
Hardness45 Shore 00ASTM 2240
Continuos Use Temp-60 to 200℃*****
Dielectric Breakdown Voltage>6000 VACASTM D149
Dielectric Constant5.5 MHzASTM D150
Volume Resistivity1.0X10¹² Ohm-meterASTM D257
Flame rating94 V0UL E331100
Thermal conductivity1.0W/m-KASTM D5470

Standard Thicknesses:


0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Thicknesses

0.020-inch to 0.250-inch (0.5mm to 6.35mm)


Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile


Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Independent R&D team


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China TIF200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer supplier

TIF200-10-02S Thermally Conductive Pad Gap Filler Thermal Pads Heat Transfer

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