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TECircuit Capability
1. Schematic development and PCB layout(what we use is Protel,
PADS)
2. PCB fabrication from 1-40 layers. (single side, double side,
multi-layer, HDI board, bury and blind holes board etc)
3. Material procurement and management
4. Prototype and NPI (new product introduction)
5. PCBA (SMD Placement include 0402,QFP,QFN,BGA etc )and through
hole assembly, in-circuit test and functional testing)
6. IC pre-programming and Function verification & burning test
7. Complete Unit assembly (Box building include the plastic,
screen, metal enclosure, membrane, coils, wire harness etc.)
8. Environmental Coating
9. Engineering including end of life components, obsolete component
replace and design support for circuit, metal and plastic enclosure
and pac
Product Inspection Services
1.QC checklistconsultation and development.
2.Sample review by qualified engineers.
3.Personalized quoting of inspection tests,procedures and sample
size tailored to fit your needs and budget.
4.Bilingual,western staffdedicated to guiding you through the
product inspection process,answering any questions and serving as
your lifeline on the ground in Asia.
5.IQC, during production inspections,final pre-shipment inspections
and container loading monitoring carried out by qualified auditors
experienced with your product type.
6.Inspection reports issues same-day at no additional cost.