High Frequency Multilayer PCB Printed Circuit Board for Wireless Base Station
Brand Name:TECircuit
Certification:UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949, ROHS,REACH. W
Model Number:TEC0160
Minimum Order Quantity:1pcs
Delivery Time:5-15 wotk days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
Contact Now
Add to Cart
Verified Supplier
Location:
Shenzhen China
Address:
Room404,Building A2,Shunjing Pioneer Park,NO3 Longteng 3rd road, jixiang community,longcheng street,longgang district,ShenZhen, China
Supplier`s last login times:
within 2 hours
Product Details
Company Profile
Product Details
Product Images
About TECircuit
Found: TECircuit has been operating since 2004.
Location: An electronics manufacturing service(EMS) provider located in
Shenzhen China.
Item: Customizable EMS PCB, offers a full range of one-stop shop services.
Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.
Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.
Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly
production capacity : 100,000 m2
Product Applications
Signal Processing Units:
- Used in RF signal processing circuits to amplify, filter, and modulate signals for effective transmission and reception.
Transceivers:
- Employed in transceiver modules that handle both transmission and reception of radio signals, crucial for mobile communication.
Antenna Interfaces:
- Integrated into PCBs that connect antennas with the base station, optimizing signal quality and range.
Power Amplifiers:
- Used in high-frequency power amplifier circuits to boost signal strength for long-range communication.
Baseband Processing:
- Employed in baseband processors that handle digital signal processing, enabling efficient data handling and conversion.
Network Interface Cards:
- Integrated into components that manage data communication between the base station and the network, ensuring high-speed connectivity.
Wireless Communication Modules:
- Used in modules for LTE, 5G, and other wireless technologies, facilitating advanced communication capabilities.
Filter Circuits:
- Employed in filter designs that eliminate unwanted frequencies and improve signal clarity.
Digital Signal Processors (DSPs):
- Integrated into circuits that perform complex calculations on digital signals for improved communication quality.
Control Systems:
- Used in control circuits that monitor and manage the operation of base station components, ensuring reliability and efficiency.
Product Features
Low Loss Material:
- Made from materials with low dielectric loss to minimize signal degradation at high frequencies, ensuring efficient signal transmission.
High Thermal Stability:
- Designed to withstand temperature variations, maintaining performance in demanding environments.
Precision Manufacturing:
- Utilizes advanced manufacturing techniques to achieve tight tolerances and high-quality finishes essential for high-frequency applications.
Impedance Control:
- Designed to maintain controlled impedance levels to prevent signal reflections and ensure consistent performance.
Multi-layer Construction:
- Often constructed as multi-layer PCBs to optimize routing and shielding of high-frequency signals, enhancing performance.
Robust Electrical Performance:
- Supports high-speed data transmission with minimal signal loss, critical for modern communication technologies.
Excellent Thermal Management:
- Designed to dissipate heat effectively, ensuring reliable operation of high-power components.
Customizable Designs:
- Can be tailored to specific application requirements, allowing for unique layouts and configurations.
Durability:
- Built to withstand harsh environmental conditions, ensuring long-term reliability in outdoor deployments.
Regulatory Compliance:
- Designed to meet industry standards for safety and performance, ensuring dependable operation in communication networks.
FAQ
Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface
finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)
Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA
Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP
for our customers in the whole process. All documents from
customers are never shared with any 3rd parties.
Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer
provided shipment method is acceptable.
Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is
acceptable.
Product Description
| Specification: | |||||
| PCB layers: | 1-42layers | ||||
| PCB materials: | CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | ||||
| PCB max. board size: | 620mm*1100mm | ||||
| PCB certificate: | RoHS Directive-Compliant | ||||
| PCB Thickness: | 1.6 ±0.1mm | ||||
| Out Layer Copper Thickness: | 0.5-5oz | ||||
| Inner Layer Copper Thickness: | 0.5-4oz | ||||
| PCB max. board thickness: | 6.0mm | ||||
| Minimum Hole Size: | 0.20mm | ||||
| Minimum Line Width/Space: | 3/3mil | ||||
| Min. S/M Pitch: | 0.1mm(4mil) | ||||
| Plate Thickness and Aperture Ratio : | 30:1 | ||||
| Minimum Hole Copper: | 20µm | ||||
| Hole Dia. Tolerance(PTH): | ±0.075mm(3mil) | ||||
| Hole dia. Tolerance(NPTH): | ±0.05mm (2mil) | ||||
| Hole Position Deviation: | ±0.05mm (2mil) | ||||
| Outline Tolerance: | ±0.05mm (2mil) | ||||
| PCB solder mask: | Black, white, yellow | ||||
| PCB surface finished: | HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver | ||||
| Legend: | White | ||||
| E-test: | 100% AOI, X-ray, Flying probe test. | ||||
| Outline: | Rout and Score/V-cut | ||||
| Inspection Standard: | IPC-A-610CCLASSII | ||||
| Certificates: | UL (E503048),ISO9001/ISO14001/IATF16949 | ||||
| Outgoing Reports: | Final Inspection, E-test, Solderability Test, Micro Section and More | ||||
High Frequency Multilayer PCB Printed Circuit Board for Wireless Base Station
Inquiry Cart
0