Semiconductor Packaging High Purity Silver Alloy Bonding Wires LED Packaging
Brand Name:WINNER
Certification:ISO9001
Model Number:YF-91
Minimum Order Quantity:1pc
Delivery Time:5~8 working days.
Payment Terms:T/T, Western Union, L/C
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Location:
Shenzhen China
Address:
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Supplier`s last login times:
within 29 hours
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Product Details
Enhance Performance in IC Packaging and LED Equipment with High Purity Silver Alloy Bonding Wire
* Exquisitely crafted from high - purity gold/silver material with
a purity reaching no less than 99%, supplemented with carefully
selected alloy elements. These alloy elements are meticulously
chosen to enhance specific properties, ensuring an optimal balance
between performance and quality.
* The surface has been meticulously treated with advanced composite materials. This treatment process not only imparts a stable structure but also endows the material with remarkable electrical and thermal conductivity. The stable structure guarantees durability and reliability during various applications, while the excellent conductivity properties make it highly efficient in conducting electricity and heat.
*When compared to traditional gold wire, this remarkable material has a distinct advantage in cost. Its lower cost structure allows for more cost - effective solutions in different manufacturing scenarios. This significant price - competitive edge makes it an attractive alternative in the market, enabling businesses to achieve better cost control without sacrificing quality.
*It is widely utilized in the packaging of ICLED and other sophisticated electronic components. Its unique combination of properties makes it an ideal choice for these applications, contributing to the enhanced performance and reliability of the final products in the ever - evolving electronics industry.
Silver alloy Bonding Wire AG99% | ||||
Type | Ø Diameter ±1% μm | Breaking Load BL(gf) | Elongation EL(%) | Length Meters |
YF-99 | 18(0.7mil) | >4 | 3-20 | 500/1000 |
99B | 20(0.8mil) | >5 | 3-20 | 500/1000 |
SW-21 | 23(0.9mil) | >7 | 3-20 | 500/1000 |
99A | 25(1.0mil) | >8 | 3-20 | 500/1000 |
99A | 30(1.2mil) | >11 | 3-20 | 500/1000 |
Note: The above Diameter, BL and EL parameters can be customized according to customer requirements.
Application:
Semiconductor Packaging High Purity Silver Alloy Bonding Wires LED Packaging
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