Product Details
Ultra Pure Aluminum Bonding Wire with High Conductivity for Wire
Bonding Applications
Optimize semiconductor packaging performance with our Ultra Pure Aluminum Bonding Wire (99.999% purity), engineered for superior electrical conductivity
and thermal stability in high-density integrated circuits. Designed
for wire bonding processes, this aluminum wire minimizes signal
loss and enhances reliability in power devices, MEMS sensors, and
automotive electronics.
Key features include:
- Enhanced Mechanical Strength: Doped with 1% magnesium to eliminate second-phase particles,
improving fatigue resistance and bonding durability under extreme
thermal cycling
- Fine Diameter Range: Available in 15–50 µm for precision bonding in microprocessors
and advanced ICs.
- Oxidation Resistance: Optimized surface treatment ensures stable performance even in
humid or corrosive environments
Ideal for ultrasonic and thermosonic bonding, our wire reduces
production costs compared to gold alternatives while maintaining
compatibility with aluminum (Al-Al) and gold (Al-Au) pad material.
* Our high quality welding wire is meticulously crafted from 6N
high purity aluminum material. This top grade aluminum forms the
core of the wire, providing it with remarkable electrical
conductivity and other outstanding physical properties. Moreover, a
specific proportion of carefully selected trace elements are added
to this base material. These trace elements are crucial as they
work in harmony with the aluminum to enhance the overall
performance of the welding wire, making it more suitable for a wide
range of applications.
* This welding wire finds extensive use in the packaging of power
semiconductors. It is an essential component in the manufacturing
process of various power semiconductor devices including MOSFET
(Metal - Oxide - Semiconductor Field - Effect Transistor), which is
widely utilized in power supply circuits and motor control systems.
IGBT (Insulated Gate Bipolar Transistor), a key element in high -
power applications like electric vehicle inverters and industrial
motor drives, also relies on this welding wire for its packaging
needs. Additionally, it is used in the packaging of Thyristor,
which is commonly employed in power control systems due to its
ability to handle high current and voltage. GTO (Gate Turn - Off
Thyristor), with its unique turn - off capability and applications
in high - power switching circuits, also depends on this welding
wire.
Al Wire for Power |
Type | Ø Diameter (μm) | Breaking Load BL(gf) | Elongation EL(%) | Length Meters |
WNE T1 | 100±5 | 50~100 | 10~30 | 500/1000/2000 |
125±5 | 60~120 | 10~30 | 500/1000/2000 |
150±5 | 100~200 | 10~30 | 500/1000/2000 |
170±5 | 140~240 | 10~30 | 500/1000/2000 |
200±7 | 150~250 | 10~30 | 500/1000/2000 |
Bonded aluminum wire applications:
* Automotive electronics
* Consumer electronics
* Computing equipment
* Chip on board (COB) technology
* Bonding of discrete components (diodes, transistors, capacitors,
resistors)
* Bonding of hybrid components
1.What kind of Enameled copper wire do Winner produce?
We focus on research and development of selfbonding magnet round
copper wire, fine polyurethane magnet wire, selfbonding litz copper
wire and selfbonding silk covered wire.
2.What's diameters available of the Enamelled copper wire ?
We specialize in fine and ultra fine enamelled copper
wire,diameters available of our products is Φ0.018-0.50mm.
3.What's selfbonding enameled copper wire?
Selfbonding enamelled copper wire is a special type of enamelled
wire with an additional adhesive enamel overcoat such as
thermoplastic resin.This adhesive has a bonding feature, which is
activated
by heat or solvents.
Once activated the adhesive bonds turn to turn windings into a
compact self supporting coil.
The use of selfbonding wire may offer cost and manufacturing
advantages in some winding applications
as bobbins, tape, varnishing, or impregnation may be eliminated.
4. Is possible to get any sample of selfbonding enamelled copper
wire that you have in production?
Of course you can!
Company Profile
Since its foundation in 2009 in Sichuan Suining, Sichuan WINNER Special Electronic Materials Co., Ltd. has built a diversified
range of business including research and development, production,
and sales of semiconductor packaging materials.
As we focused on A Ultra-fine Coated Metal Wire, WINNER is becoming a glabal leader in this industry. Currently, it has a
plant construction area of 15,000 square meters, including a clean
room area of 11,000 square meters, with a cleanliness level of less
than 10,000 grades, and the winding clean bench reaches 1,000
grades.
WINNER has gathered top technical and management experts in the industry
and has successfully developed high-purity aluminum wires,
high-purity copper wires, gold-palladium-copper wires, pure gold
wires, silver alloy wires, etc., suitable for discrete
semiconductor devices and IC packaging;
WINNER passed the national high-tech enterprise certification in 2015,
and currently has more than 40 research and development.
Over the course of many years, all group companies within China
work together with unified cooperation between manufacturing,
sales, and technological aspects to offer products and services.
Additionally, to make further progress in globalization, the five
core companies that make up Sichuan Winner are as follows.
- Sichuan WINNER Special Electronic Materials Co., Ltd. (Head office)
- Winner (Shanghai) Semiconductor Materials Co., Ltd.
- Winner (Suzhou) Branch
- Shenzhen Youfu Technology Co., Ltd.(Overseas Development
Department)

