Ultra Fine Wire Good Loop Stability 0.01 Mm Copper Bonding Wire For Communications
Brand Name:WINNER
Certification:ISO 9001, ISO 14001, RoHS
Model Number:WCBW-1
Minimum Order Quantity:1pc
Delivery Time:5~8 working days.
Payment Terms:T/T, Western Union, L/C
Contact Now
Add to Cart
Verified Supplier
Location:
Shenzhen China
Address:
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
Supplier`s last login times:
within 29 hours
Product Details
Company Profile
Product Details
Ultra Fine wire Good loop stability 0.01 mm Copper Bonding Wire for Communications
| Characteristics |
| * High conductivity * High tensile strength with high elongation * Good loop stability * Significantly reduced formation of intermetallic phases * Very good ball formation under protective gas |
Description of Copper Bonding Wire
The Copper bonding wire is material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. The Copper bonding wire has the advantages of low price, good mechanical properties, and high electrical conductivity. Winner can provide Copper bonding wire with different wire diameters from 15um-50um according to customer requirements.
The Copper bonding wire is material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. The Copper bonding wire has the advantages of low price, good mechanical properties, and high electrical conductivity. Winner can provide Copper bonding wire with different wire diameters from 15um-50um according to customer requirements.
Applications include:
* Computer : PC, Tablets, Servers & systems, Consumer
* Computer : PC, Tablets, Servers & systems, Consumer
* Electronics : Smartphones & phones, TVs, Imaging devices,
Wearable electronics
* Automotive : Body, Safety, Infotainment, Chassis, Powertrain, Security
* Communications : Wireless, Wired, Satellite, NFC
* Energy : Generation, Transmission & distribution, Storage
* Automotive : Body, Safety, Infotainment, Chassis, Powertrain, Security
* Communications : Wireless, Wired, Satellite, NFC
* Energy : Generation, Transmission & distribution, Storage
| Dia | EL(%) | BL(gf) | |||||||
| mil | um | 4N | 5N | 4N | 5N | ||||
| WCBW-1 | WCBW-2 | WCBW-3 | WCBW-4 | WCBW-5 | WCBW-6 | WCBW-7 | WCBW-8 | ||
| 0.6 | 15 | 3-15 | 3-15 | 3-16 | 3-17 | >3.0 | >3.0 | >3.0 | >3.0 |
| 0.7 | 18 | 3-17 | 3-17 | 3-18 | 4-19 | >3.0 | >3.0 | >3.5 | >4.0 |
| 0.8 | 20 | 4-18 | 4-18 | 4-19 | 5-20 | >4.0 | >4.5 | >5.0 | >5.0 |
| 0.9 | 23 | 6-20 | 6-20 | 6-21 | 6-22 | >5.0 | >6.0 | >6.0 | >6.5 |
| 1.0 | 25 | 8-22 | 8-23 | 8-24 | 8-24 | >6.0 | >7.0 | >7.0 | >8.0 |
| 1.2 | 30 | 9-23 | 9-24 | 9-25 | 9-26 | >8.0 | >8.5 | >8.0 | >10.0 |
| 1.3 | 33 | 9-24 | 10-25 | 10-26 | 10-27 | >10.0 | >11.0 | >10.0 | >12.0 |
| 1.5 | 38 | 10-25 | 10-26 | 10-27 | 11-28 | >12.0 | >12.0 | >12.0 | >14.0 |
| 1.7 | 43 | 10-26 | 11-28 | 10-30 | 11-30 | >15.0 | >16.0 | >15.0 | >18.0 |
| 2.0 | 50 | 12-28 | 12-30 | 12-32 | 12-34 | >20.0 | >20.0 | >20.0 | >20.0 |
The Advantages of Copper Bonding Wire Cost Savings
The relatively low cost of copper is one of the reasons for its
appeal as an alternative interconnect material. By replacing gold
wires with copper material, thus replacing the precious metal part,
significant cost savings are possible. In applications that require
increased wire diameters, the usage of copper bears a
disproportionately high impact on the saving effect. Superior
Performance of Copper Wires Copper exhibits significantly better
conductivity than gold or aluminum. Therefore better heat
dissipation and increased power ratings are attainable with thinner
wire diameters. Copper possesses higher mechanical properties
compared to gold. Therefore it displays excellent ball neck
strength and high loop stability during molding or encapsulation.
Ultra Fine Wire Good Loop Stability 0.01 Mm Copper Bonding Wire For Communications
Inquiry Cart
0