Ultra Fine Pd Coated Copper Wire With Bright Blue Coating High Strength 0.01mm Silver Core Bonding Wire For Semiconductor And 5G Device Assembly
Brand Name:WINNER
Certification:ISO9001，ROHS
Model Number:PW-17
Minimum Order Quantity:1pc
Delivery Time:5~8 working days.
Payment Terms:T/T, Western Union, L/C
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Shenzhen China
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B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
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Ultra Fine Palladium Plated Copper Wire with Bright Blue Coating High Strength 0.01mm Silver Core Bonding Wire for Semiconductor and 5G Device Assembly
Designed for high-density semiconductor and 5G millimeter-wave applications, this ultra-fine 0.01mm palladium-plated copper wire features a dual-layer silver core and proprietary bright blue polymer coating to address signal integrity and oxidation challenges in next-gen
electronics. The silver core delivers ultra-low resistivity (≤1.5 μΩ·cm) for high-frequency 5G antenna modules, while the 0.1μm palladium
coating prevents sulfidation in humid environments, extending
lifespan by 50% vs. standard copper wires.
Optimized for automated thermosonic bonding, its ≥4,200 MPa tensile strength and anti-sagging design enable flawless 30μm pitch interconnects
in 3D IC stacking and RF front-end packaging. The bright blue
coating acts as a visual QC marker for defect detection during high-speed assembly, reducing rework
rates by 25%.
ROHS-compliant and JEDEC-QPL listed, it replaces gold wires in 5G base stations
and AIoT devices, cutting material costs by 60% while achieving <0.5dB signal loss at 28GHz. Trusted by global OSATs, this wire is the backbone of
miniaturized, high-reliability connectivity for 5G smartphones, GaN
power amplifiers, and edge-computing chips.
Palladium-Coated Copper (PCC) bonding wire was developed and has
now become the most dominant bonding material used in fine wires of
diameters of <50 microns being used as substitute for more
expensive gold. Thermosonic wire bonding is the most popular form
of interconnection for most semiconductors. It requires the
creation of a molten Free-Air Ball (FAB) at the end of the wire
that is then ultrasonically-pressed on semiconductor bonding pads
to form the first bond
| Features: |
* Gold-plated/palladium bonding wire made of 4N high-purity copper
material with a certain proportion of trace elements added; * In addition to the characteristics of conventional copper wire,
it also has high strength,low curvature, high toughness, and
anti-oxidation * Chemical characteristics, the arc isimpact-resistant and the
welding wire is corrosion-resistant; * Surface gold/palladium special bonding wire developed for IC
packaging; |
What Is Palladium Coated Copper Bonding Wire?
Palladium Coated Copper Bonding Wire is easier to bond than your
standard bare copper wire. The Palladium (Pd) coating allows for
high performance and stable bonding, all within a wider bonding.
The Pd coating controls the oxidation build up that can occur on
the surface of the copper wire.
Pd Coated Copper Wire | ||||
Type | Ø Diameter ±1% μm | Breaking Load BL(gf) | Elongation EL(%) | Length Meters |
PW-1 | 18(0.7mil) | >4 | 8-14 | 500/1000/2000 |
20(0.8mil) | >5 | 9-15 | 500/1000/2000 | |
23(0.9mil) | >7 | 10-17 | 500/1000/2000 | |
25(1.0mil) | >9 | 11-17 | 500/1000/2000 | |
30(1.2mil) | >14 | 14-22 | 500/1000/2000 | |
Note: The above Diameter parameters can be customized according to customer requirements.
Application:
Ultra Fine Pd Coated Copper Wire With Bright Blue Coating High Strength 0.01mm Silver Core Bonding Wire For Semiconductor And 5G Device Assembly
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