0.01mm Ultra Fine Palladium Plated Copper Wire Flexible Solution for High Density Circuit Board Interconnects
Brand Name:WINNER
Certification:ISO9001，ROHS
Model Number:PW-22
Minimum Order Quantity:1pc
Delivery Time:5~8 working days.
Payment Terms:T/T, Western Union, L/C
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Shenzhen China
Address:
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
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0.01mm Ultra Fine Palladium Plated Copper Wire Flexible Solution for High Density
Circuit Board Interconnects
Discover our 0.01mm ultra fine palladium plated copper wire, a
revolutionary solution for high density circuit board
interconnects. Its ultra - fine diameter allows for maximum packing
density on circuit boards, enabling more components to be
integrated into a limited space.
The palladium plating offers excellent corrosion resistance, which
extends the wire's lifespan and ensures stable performance over
time. What truly sets it apart is its flexibility. This wire can be
easily bent and shaped during the assembly process, adapting to
complex circuit layouts without breaking.
Whether used in consumer electronics or advanced industrial
equipment, it provides reliable electrical connections, making it
an ideal choice for high - density circuit board applications.
Palladium-Coated Copper (PCC) bonding wire was developed and has
now become the most dominant bonding material used in fine wires of
diameters of <50 microns being used as substitute for more
expensive gold. Thermosonic wire bonding is the most popular form
of interconnection for most semiconductors. It requires the
creation of a molten Free-Air Ball (FAB) at the end of the wire
that is then ultrasonically-pressed on semiconductor bonding pads
to form the first bond
| Features: |
* Gold-plated/palladium bonding wire made of 4N high-purity copper
material with a certain proportion of trace elements added; * In addition to the characteristics of conventional copper wire,
it also has high strength,low curvature, high toughness, and
anti-oxidation * Chemical characteristics, the arc isimpact-resistant and the
welding wire is corrosion-resistant; * Surface gold/palladium special bonding wire developed for IC
packaging; |
What Is Palladium Coated Copper Bonding Wire?
Palladium Coated Copper Bonding Wire is easier to bond than your
standard bare copper wire. The Palladium (Pd) coating allows for
high performance and stable bonding, all within a wider bonding.
The Pd coating controls the oxidation build up that can occur on
the surface of the copper wire.
Pd Coated Copper Wire | ||||
Type | Ø Diameter ±1% μm | Breaking Load BL(gf) | Elongation EL(%) | Length Meters |
PW-1 | 18(0.7mil) | >4 | 8-14 | 500/1000/2000 |
20(0.8mil) | >5 | 9-15 | 500/1000/2000 | |
23(0.9mil) | >7 | 10-17 | 500/1000/2000 | |
25(1.0mil) | >9 | 11-17 | 500/1000/2000 | |
30(1.2mil) | >14 | 14-22 | 500/1000/2000 | |
Note: The above Diameter parameters can be customized according to customer requirements.
Application:
0.01mm Ultra Fine Palladium Plated Copper Wire Flexible Solution for High Density Circuit Board Interconnects
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