High Performance Palladium Coated Copper Wire 15μm Thickness 30% Harder than Gold for Automotive Medical Telecom Chip Modules
Brand Name:WINNER
Certification:ISO9001
Model Number:PW-25
Minimum Order Quantity:1pc
Delivery Time:5~8 working days.
Payment Terms:T/T, Western Union, L/C
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Location:
Shenzhen China
Address:
B105, 90-5 Dayang Road, Rentian Community, Fuhai Street, Bao'an District, Shenzhen,P.R.China
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Product Details
High Performance Palladium Coated Copper Wire 15μm Thickness 30% Harder than Gold for Automotive Medical Telecom Chip Modules
Discover our High Performance Palladium Coated Copper Wire. With a
15μm thickness, it's 30% harder than gold. Ideal for automotive,
medical, telecom, and chip modules. Made from high - purity
materials, it offers excellent conductivity and durability. Its
unique coating ensures resistance to corrosion. This wire is
engineered to meet the rigorous demands of critical industries,
delivering reliable performance and long - term stability.
Material and Composition of the Bonding Wire
Our gold - plated/palladium bonding wire is made from 4N high - purity copper. The high purity ensures reliability and good electrical conductivity. We also added a proportion of trace elements in a controlled way. These elements, selected through research, enhance the wire's performance.
Our gold - plated/palladium bonding wire is made from 4N high - purity copper. The high purity ensures reliability and good electrical conductivity. We also added a proportion of trace elements in a controlled way. These elements, selected through research, enhance the wire's performance.
Unique Characteristics
the welding wire is corrosion - resistant. Corrosion can cause serious damage to the wire and lead to failure of the entire packaging system. Our special bonding wire is formulated to resist corrosion from various chemical substances that it may come into contact with during its use, whether it's in the manufacturing environment or during the normal operation of the IC.
Application in IC Packaging
This special gold/palladium bonding wire is for IC packaging. Its properties make it ideal for connecting IC components, providing stable electrical connections, withstanding mechanical stress, and resisting oxidation, arcs, and corrosion for optimal and stable IC performance, meeting modern electronics manufacturing requirements.
Pd Coated Copper Wire | ||||
Type | Ø Diameter ±1% μm | Breaking Load BL(gf) | Elongation EL(%) | Length Meters |
PW-1 | 18(0.7mil) | >4 | 8-14 | 500/1000/2000 |
20(0.8mil) | >5 | 9-15 | 500/1000/2000 | |
23(0.9mil) | >7 | 10-17 | 500/1000/2000 | |
25(1.0mil) | >9 | 11-17 | 500/1000/2000 | |
30(1.2mil) | >14 | 14-22 | 500/1000/2000 | |
Note: The above Diameter parameters can be customized according to customer requirements.
Application:
High Performance Palladium Coated Copper Wire 15μm Thickness 30% Harder than Gold for Automotive Medical Telecom Chip Modules
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