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Designed to operate under harsh conditions, with robust construction that ensures long-lasting performance, reducing the risk of data loss.
Capable of functioning in extreme temperatures (typically -40°C to +85°C), making it suitable for outdoor and industrial applications.
Many industrial-grade eMMC solutions include features that safeguard against data corruption during sudden power loss, ensuring reliable data preservation.
Integrated into a small form factor, allowing for efficient use of space in embedded systems and devices.
Designed to be energy-efficient, making it ideal for battery-powered devices and applications where power conservation is critical.
Compatible with a variety of embedded systems, facilitating straightforward integration into existing designs.
Often meets or exceeds relevant industry certifications, ensuring suitability for regulated applications in sectors like automotive, medical, and telecommunications.
While industrial-grade eMMC may come at a higher initial cost than consumer-grade options, its durability and reliability can lead to lower total cost of ownership in high-volume, long-term applications.
Model | G2564GTLIA | G25128TLIA | G25256TLIA | G25512TLIA |
NAND flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
Capacity | 64GB | 128GB | 256GB | 512GB |
CE | 1 | 2 | 4 | 4 |
Read speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
Write speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
Operating temperature | -40℃~85℃/-45℃~105℃ | -40℃~85℃/-45℃~105℃ | -40℃~85℃/-45℃~105℃ | -40℃~85℃/-45℃~105℃ |
EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 |
Packaging specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm |