Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer

Brand Name:Suneast
Certification:CE、ISO
Model Number:SEMI-E3
Minimum Order Quantity:≥1 pc
Delivery Time:25~50 days
Payment Terms:T/T
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Verified Supplier
Location: Shenzhen Guangdong China
Address: Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China
Supplier`s last login times: within 27 hours
Product Details Company Profile
Product Details

Gold/Silver Paste Fully Automatic Semiconductor Printer


Adopt screen printing to print conductor paste, resistor paste, or dielectric paste onto ceramic substrates, after high-temperature sintering, these materials will form a firmly adhered film on the ceramic circuit board. After repeated multiple times, a multi-layer interconnected circuit which contains the resistors or capacitors will be formed. Suneast gold paste/silver paste fully automatic semiconductor printer adopts modular design and humanized structure, which can cope with high-precision requirements for film thickness uniformity such as gold paste, conductive silver paste, R glue, and glass base glaze.


Application:

Suneast Semiconductor Fully Automatic Screen Printer SEMI-E3 is widely used in the printing process of semiconductor devices, thermal print heads, ceramic capacitors, ceramic circuits, filters, potentiometers, dielectric antennas, RFID, LTCC, MLCC, sensors, piezoelectric ceramic components, chip components and other products.


Features and advantages:

◆ The new appearance design is beautiful, stable and meets the standards of ergonomics and human engineering.

◆ For debugging for necessary parameters during the process production, it is equipped with SPI online function, so that the material replacement and printing quality can be truly intelligently controlled.

◆ New and advanced UI software interface, with portable and smart software, and the easy-to-understand and easy-to-operate Chinese and English systems make the product easy to use and has no geographical boundaries.

◆ The newly upgraded optical path system, in addition to ensuring good MARK recognition capabilities, also meets the traceability requirements required by the current intelligent line.

◆ The dust-proof design meets the working requirements of the equipment in a thousand-level cleanliness environment.

◆ The newly designed high-precision printing platform provides a guarantee for the consistency of printed film thickness, and the film thickness accuracy can reach ±1 micron.

◆ The CCD vision module adopts a linear motor gantry dual-drive structure to provide guarantees for equipment accuracy and stability.

◆ The LOT board function enhances the intelligent processing capabilities of the equipment.


Module introduction:

Substrate positioning module:

1. Full servo UVW module with advanced platform calibration algorithm to improve substrate alignment accuracy and stability.

2. High-precision vacuum adsorption, positioning and support mechanism to perfectly meet the clamping and positioning requirements of thick film printing process.

3. Provide vacuum negative pressure monitoring and vacuum breaking functions.


Robot handling module:

1. Avoid product contamination, effectively reduce the substrate contamination problem caused by powder loss during traditional belt conveyor, and is suitable for operation in a high-cleanliness environment.

2. The three-stage track conveying mechanism effectively improves product production efficiency.


CCD vision module:

1. The CCD vision module adopts a gantry dual-drive motion structure, which can effectively solve the problem of uneven force on both ends of the beam of the traditional transmission mechanism.

2. Both CCD X-axis and Y-axis are driven by linear motors, which greatly improves the visual positioning accuracy and efficiency.


Squeegee printing module:

1. Adjustable screen frame arm with scale to meet the needs of fast fixing of screens of different specifications.

2. Specially made one-lay one-scrape squeegee, and the squeegee head is adjustable in Y direction to meet the centering adjustment of substrates with different widths.

3. Adjustable Y-direction positioning mechanism to achieve fast switching of screens;

4. Innovative long-side printing method reduces squeegee length and improves squeegee force uniformity.


Squeegee pressure control module:

1. Multiple pressure control modes (drop control, closed-loop pressure control, normal pressure control, etc.) to meet the pressure setting requirements of the equipment under different processes.

2. The printing angle adaptive squeegee structure can fit the screen and achieve uniform pressure better.

3. Real-time pressure monitoring system to achieve closed-loop control of squeegee pressure.


Cleaning module:

1. Spray cleaning agent feeding system, which can realize precise control of cleaning agent through the software.

2. Programmable cleaning mode setting, which can realize intelligent cleaning operation.

3. The flexible wiping board structure can fit the screen in real time, which can better improve the cleaning effect.


Automatic paste feeding module:

1. It can be customized according to the size of the customer's paste tank to prevent poor printing caused by untimely manual paste feeding.

2. Automatically add paste to reduce labor costs.

3. Automatically prompt to replace the paste tank.


parameter:

Machine Performance
Repeat Position Accuracy± 8um@6σ,CPK≥2.0
Repeat Print Accuracy±15um@6σ,CPK≥2.0
Printing film thickness accuracy±1um
Printing thinnest thickness5um
Excluding cleaning and printing7sec
Processing CT4min
Line Change CT2min
Substrate Processing Parameters
Maximum Laminate Dimension

Standard 270*70mm

None-standard can be customized

Minimum Laminate Dimension

Standard 270*70mm

None-standard can be customized

Laminate Thickness0.5-2mm
Mechanical Range of Capture560(X)*540(Y)mm
Maximum Laminate Weight1kg
Marginal Gap of Laminate0mm
Height over the Top0mm(can be customized)
Transmission Height900±40mm
Transmission Speed(Control by section):1500mm/s(max)
Way of TransmissionThree-section transmission guide rail and manipulator handing
Transmission Direction

standard:From left to right

From right to left can be customizable

Laminate Support MethodVacuum platform
Laminate ClampingFlexible side clamps and Vacuurm suction function
Printing Parameters
Printing Speed10-200mm/sec
Printing Pressure control Method

0.5~20Kg(pressure control)

0.01~10mm(position control)

Printing Mode

Single scraper printing

Double scraper printing

Inking left and printing right

Inking right and printing left

Scraper TypeRubber scraper/steel scraper (angle: 45/55/60)
Stripper Distance0~20mm
Stripper Speed0-20mm/sec
Size of Steel Mesh Frame

470(X)*370(Y)mm~737(X)*737(Y)mm

(Thickness:20-40mm)

Positioning Method of Steel MeshManual compensation adjustment
Cleaning Parameters
Cleaning MethodDry wiping wet wiping vacuum
High Speed CleaningIntegral & back and forth cleaning
Cleaning SystemTop spray type
Cleaning StrokeGenerated automatically based on the length and width of the laminate
Cleaning PositionPosting-cleaning
Cleaning Speed10-200mm/sec
Consumption of Cleaning FluidGenerated automatically. Manually adjustable
Consumption of Cleaning PaperGenerated automatically. Manually adjustable
Image Parameters
Field of Vision of Image7 mm*5.5 mm
Camera Typeimported digital camera
Image Pickup SystemUp-dawn Imaging, stepless adjustment of light source
Capture CT100ms
Type of Datum Point

Datum point of stanclard shapes

Such as circle, square, rhombus, cross

Bonding pad and special-shaped

Mark Size0.1-4 mm
Number of Marks2 pcs
Number of Fool. Proof Pointssoftware configurable
Machine Parameter
Power RequirementAC:220±10%,50/60Hz 2.2KW
Requirement of Compressed Air4~6Kgf/cm²
Gas ConsumptionAbout 5L/min
Temperature of Working Environment-20°C-+45°C
Humidity of Working Environment30%~60%
Machine Height (Excluding tricolor light)1665 mm
Machine Length X-Direction1140 mm
Machine Width Y-Direction1155 mm
Machine WeightAbout 900Kg
China Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer supplier

Gold / Silver Paste Printer Machine Fully Automatic Semiconductor Printer

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