HL140S 14 Inch New Ultra-thin Customized School RAM 16GB Laptop For Education Support

Theory

The device uses a multi-modal hinge system to achieve 180° opening and closing and tablet mode conversion, and ensures stability at all angles through precision gear sets and electromagnetic locking mechanisms. The D-shell movable bracket uses a double-track slide structure and magnetic positioning technology to achieve one-handed adjustment and stepless hovering. The 92% screen-to-body ratio is due to the innovative GIA (Glass Integrated Assembly) screen packaging technology, which integrates the drive circuit directly into the glass substrate. The large round cap keyboard adopts an X-shaped double-track support structure, combined with micro-hole light guide technology to achieve 1.5mm key travel and uniform backlight. Fingerprint recognition integrates 3D ultrasonic sensing and liveness detection algorithms to ensure security and unlocking speed.

Technology

The whole machine adopts a magnesium-lithium alloy die-cast frame, and the strength-to-weight ratio is improved by differential heat treatment. The hinge assembly is formed by powder metallurgy, and the liquid metal bearing achieves a life of 200,000 rotations. The screen adopts a vacuum bonding process to complete the integrated packaging of the display layer and the touch layer in a dust-free environment. The movable bracket is manufactured using the MIM (metal injection molding) process, and the surface is treated with a ceramic-like frosted treatment. The keyboard uses laser micro-perforation technology to accurately open holes on the 0.2mm thick light guide plate. The fingerprint module adopts a wafer-level packaging process, and plasma cleaning is used to ensure the sensing accuracy. The whole machine has passed the IP6X dustproof and 1.2-meter drop test certification.