Product Details
DBSP Bis(Phenylsulfonyl)Phenol Thermal Paper Photographic Developer
Product Description
Chemical Name:DBSP Bis(Phenylsulfonyl)Phenol Thermal Paper Photographic Developer
Molecular formula: C18H14O5S2
Molecular weight: 374.43
CAS NO. 177325-75-6
1) Product Features:
High purity.
2) Quality Standards: Q/LZ 99-2008
Appearance: White powder
Purity: min 99%
Melting point: 155-157℃
loss on drying:≤0.30%
3) Application
Usage: Thermal Paper Photographic Developer,Heat Sensitizing
Coupler Agents
Chemical nature
Product | DBSP |
Appearance | White powder |
Purity | min 99% |
Melting point | 155-157℃ |
loss on drying | ≤0.30% |
Usage | Thermal Paper Photographic Developer |
Characteristic | High purity |
Company Profile
Hubei Dimei Technology Co., Ltd, in partnership with Wuhan
Institute of Technology, is a high-tech and national
technology-innovation support enterprise, specializing in
electroplating intermediates. We have twenty years experience in
electroplating intermediates area. To make sure our products are
accurate and with good stability, we keep strict quality control
from raw materials purchasing to manufacturing process. We are
striving to provide high-level products to electroplating industry
and make our products'quality competing with the well-known brands
all over the world.
Our products have wide varieties, good quality and reasonable
prices, some of which such as MPA, PPS, Propane Sultone, and SPS
have been widely exported to many developed countries. It is the
first choice for the electroplating manufacturers. Also, the full
set of acid cooper intermediates have already been put into scale
production. Thus, we can supply cooper plating intermediates of
advanced international standards.
The enterprise has strong technical team and strictly performs
scientific management. We have built up strong after-sale service
system and can offer our customers professional service and
technical support. We are willing to develop with friends from both
China and abroad, to create a greater future together.