4mil 8 Layer Pcb Board Altium Multilayer PCB Production Service

8 Layer Printed Circuit Boards Altium Multilayer PCB Production Service

Basic information:

Board size: 16*15CM

Layer: 8 layer printed circuit board

Solder mask: Black

Copper weight: 2OZ

Material: FR4

Name: 8 layer Multilayer PCB fabrication

Blind hole and via filled and capped:yes

Min line:4mil

Min hole:0.25MM

The difference of 4/6/8 layer pcb:

Generally 4 layer pcb: SIG→GND(PWR)→PWR(GND)→SIG

6 layer pcb have 3 different arrange way

8 layer pcb have 3 different arrange way,see below:

First

1 Signal 1 components side, microstrip line layer

2 Signal 2 inner microstrip line layer

3 Ground

4 Signal 3 Stripline line layer

5 Signal 4 Stripline line layer

6 Power

7 Signal 5 inner microstrip line layer

8 Signal 6 microstrip line layer

Second

Due to the increase of the reference layer, with good EMI performance, the signal layer of the characteristic impedance can be well controlled

1 Signal components side, microstrip line layer

2 Ground GND,Good electromagnetic wave absorption capacity

3 Signal Stripline line layer

4 Power PWR, and the underlying formation constitutes excellent electromagnetic absorption

5 Ground GND

6 Signal Stripline line layer

7 Power GND, With a large power supply impedanc

8 Signal Stripline line layer

Third:

The best stacking mode, because the use of multilayer ground reference plane has a very good magnetic absorption capacity

1 Signal components side, microstrip line layer

2 Ground GND,Good electromagnetic wave absorption capacity

3 Signal Stripline line layer

4 Power PWR, and the underlying formation constitutes excellent electromagnetic absorption

5 Ground GND

6 Signal Stripline line layer

7 Ground GND,Good electromagnetic wave absorption capacity

8 Signal Stripline line layer

EMC of these types of circuit boards is still a big difference, if it is high-speed version, then consider EMC, then at least 8 layers, 4 signal layers, in accordance with the signal - ground - signal - ground - power - signal - ground Of the arrangement in order to take the four signal layers are high-speed signal lines

How to design multilayer pcb layer number:

For how to choose the design with multilayers and the stack, need according to the number of signal on the circuit board, device density, PIN density, signal frequency, board size and many other factors. For these factors we have to consider. The more the number of signal networks, the greater the density of the device, the greater the density of the PIN, the higher the frequency of the signal should be designed with multilayer design. It is best to ensure that each signal layer has its own reference layer for good EMI performance.

Multilayer pcb stack up

The stack-up of a multilayer PCB refers to the arrangement and order of the layers in the PCB construction. The stack-up is a critical aspect of PCB design as it determines the electrical performance, signal integrity, impedance control, and thermal characteristics of the board. The specific stack-up configuration depends on the requirements of the application and the design constraints. Here is a general description of a typical multilayer PCB stack-up:

1,Signal Layers: The signal layers, also known as the routing layers, are where the copper traces that carry electrical signals are located. The number of signal layers depends on the complexity of the circuit and the desired density of the PCB. The signal layers are typically sandwiched between the power and ground planes for better signal integrity and noise reduction.

2,Power and Ground Planes: These layers provide a stable reference for the signals and help distribute power and ground throughout the PCB. The power planes carry the supply voltages, while the ground planes serve as return paths for the signals. Placing power and ground planes adjacent to each other reduces the loop area and minimizes electromagnetic interference (EMI) and noise.

3,Prepreg Layers: Prepreg layers consist of insulating material impregnated with resin. They provide insulation between adjacent signal layers and help bond the layers together. Prepreg layers are typically made of fiberglass-reinforced epoxy resin (FR-4) or other specialized materials.

4,Core Layer: The core layer is the central layer of the PCB stack-up and is made of a solid insulating material, often FR-4. It provides mechanical strength and stability to the PCB. The core layer may also include additional power and ground planes.

5,Surface Layers: The surface layers are the outermost layers of the PCB, and they can be signal layers, power/ground planes, or a combination of both. The surface layers provide connectivity to external components, connectors, and soldering pads.

6,Soldermask and Silkscreen Layers: The soldermask layer is applied over the surface layers to protect the copper traces from oxidation and prevent solder bridges during the soldering process. The silkscreen layer is used for component markings, reference designators, and other text or graphics to assist in PCB assembly and identification.

The exact number and arrangement of layers in a multilayer PCB stack-up vary depending on the design requirements. More complex designs may have additional power planes, ground planes, and signal layers. Additionally, controlled impedance traces and differential pairs may require specific layer arrangements to achieve desired electrical characteristics.

It's important to note that the stack-up configuration should be carefully designed, taking into consideration factors such as signal integrity, power distribution, thermal management, and manufacturability, to ensure the overall performance and reliability of the multilayer PCB.