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Rogers 3003 Gold Plated High Level Quality PCB Circuit Boards
Quick detail:
Material:High frequency rogers 3003
Layer:2
Surface finish:Gold plated
Board size:6*3cm
Thickness:0.8mm
Copper weight:0.5OZ
Name:rogers 3003 gold plated high level qulity PCB printed circuit boards
Rogers - High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminat ( not PTFE ) designed for performance sensitive, high volume commercial applications
Rogers 3003 PCB:
The RO3003 from Rogers Corp. is a ceramic-filled PTFE composite/laminate for use in commercial microwave and RF applications. It features excellent stability with a dielectric constant of 3 up to 40 GHz at room temperature. The material has a dissipation factor (Df) of 0.0013 at 10 GHz and is ideal for band pass filters, microstrip patch antennas, and voltage controlled oscillators.
By far the most commonly used is the Rogers RO4000 series of high frequency materials.
RO4350B laminate is a hydrocarbon/ceramic base, which can be manufactured using
standard FR-4 type multilayer processes, making it not only popular but economical to
manufacture. Low dielectric loss is the major appealing characteristic of this material.
Multilayers can be constructed of a “pure package” using Rogers 4450 prepreg, or by using standard FR-4 prepreg. Popular constructions limit the Rogers material to the “caps” of the stackup thereby managing overall cost by using the material only where it is required, and filling the remainder of the board with standard FR-4 cores/prepreg.
PTFE, commonly known as “” is another fairly common callout for this genre’s
material requirements. There are many different formulations and laminates such as
Rogers 3000 series ceramic-filled PTFE composites, R/T Duroid 5870 and 5880 glass
microfiber reinforced PTFE, etc. They can be very difficult in multilayer configurations
however, as some require the use of high temperature bonding films or adhesives. The old saying that “nothing likes to stick to !” sometimes holds true! But their extremely low loss characteristics make them ideal for exacting stripline and microstrip circuit designs.
PCB basic information:
Oneseine Technology Go.,LTD | ||
Seq | Item | capability |
1 | Base Material | FR-4, High TG FR-4 , Halogen Free material ,CEM-3,CEM-1,PTFE,Rogers ,Arlon ,Taconic,Aluminum base,,PI ,etc |
2 | Layers | 1-40 ( ≥30 layers needs review ) |
3 | Finished inner/outer copper thickness | 0.5-6OZ |
4 | Finished board thickness | 0.2-7.0mm(≤0.2mm needs review),≤0.4mm for HASL |
Board thickness≤1.0mm: +/-0.1mm | ||
5 | Max panel size | ≤2sidesPCB: 600*1500mm |
6 | Min conductor line width/spacing | Inner layers: ≥3/3mil |
7 | Min hole size | Mechanical hole: 0.15mm |
Drilling precision: first drilling First drilling: 1mil | ||
8 | Warpage | Board thickness≤0.79mm: β≤1.0% |
9 | Controlled Impedance | +/- 5 % Ω(<50Ω),+/-10%(≥50Ω),≥50Ω+/-5% (needs review) |
10 | Aspect Ratio | 15:01 |
11 | Min welding ring | 4mil |
12 | Min solder mask bridge | ≥0.08mm |
13 | Plugging vias capability | 0.2-0.8mm |
14 | Hole tolerance | PTH: +/-3mil |
15 | Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
16 | Solder mask color | Green,yellow,black,blue,red,white,matte green |
17 | Component mark color | white,yellow,black |
18 | Surface treatment | OSP: 0.2-0.5um |
19 | E-Test | Flying probe tester : 0.4-6.0mm,max 19.6*23.5inch |
Min spacing from test pad to board edge : 0.5 mm | ||
Min conductive resistance : 5 Ω | ||
Max insulation resistance : 250 MΩ | ||
Max test voltage : 500 V | ||
Min test pad diameter : 6 mil | ||
Min test pad to pad spacing : 10 mil | ||
Max test current : 200 MA | ||
20 | AOI | Orbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch |
Orbotech Ves machine : 0.05-6.0mm,max 23.5*23.5inch |
RT/duriod
Rogers RT/duroid® high-frequency circuit materials are filled PTFE (irregular glass or ceramic) composite coversfor use in high reliability, aviation and defense applications. The RT/duroid types have a long industry nearness of providing high-reliability materials with predominant performance. This kind of material has several benefits:
1 Low electrical loss,
2. Low moisture absorption,
3. Stable dielectric constant (Dk) over a wide frequency range, and
4. Low outgassing for space applications.
RO3000
RO3000 laminates are ceramic filled PTFE composites intended for use in the commercial microwave and RF applications. R03000 series laminates are circuit materials with very consistent mechanical properties regardless of the dielectric constant selected. Due to this characteristic, when designing multi-layer boards with varying dielectric constants, there will be very little issues if any at all The dielectric constant VS temperature of RO3000 series materials is very stable. RO3000 laminates also are available in a wide range of dielectric constants (3.0 to 10.2). The most common applications are:
1. Surface mount RF components,
2.GPS antennas, and
3. Power amplifiers.
RO4000
RO4000 laminates and pre-pregs possess favorable properties that are highly useful in microwave circuits and instances where controlled impedance is needed. This series of laminates are very price optimized and are also fabricated using standard FR4 processes which makes it suitable for multi-layer PCBs. Additionally, it can be processed lead-free. The series of RO4000 laminates offer a range of dielectric constants (2.55-6.15) and are available with UL 94 V-0 flame retardant versions. The most popular applications of this are:
1. RFID chips,
2. Power amplifiers,
3. Automotive radars, and
4. Sensors.
TMM®
Rogers TMM® thermoset microwave laminates fuse dielectric constant
uniformity, low thermal coefficient of dielectric constant (Dk),
and a copper matched coefficient of thermal expansion. Because of
their electrical and mechanical stability, TMM high-frequency
laminates are perfect for high-reliability strip-line and
micro-strip applications. This kind of material has several
benefits:
1. Wide range of dielectric constants (Dks),
2.Excellent mechanical properties, cold flow, and resists creep,
3. Exceptionally low thermal coefficient of Dk,
4. Coefficient of thermal expansion fit to copper taking into
account high reliability of plated through-holes,
5. Available copper clad in larger formats, allowing the use of
standard PCB subtractive processes,
6. No wreck to materials during fabrication and assembly processes,
Resistant to process chemicals,
7. Thermoset resin for reliable wire bonding,
8. No specialized production techniques required,
9. TMM 10 and 10i laminates can replace alumina substrates, and
10. RoHS compliant, environmentally friendly.Below is a table that
shows the characteristics of various types of PCB materials.