Fr4 Epoxy Laminate HASL LF PCB Green Fr4 Printed Circuit Board Maker

Fr4 Epoxy Laminate HASL LF PCB Green Fr4 Printed Circuit Board Maker

Basic technology:

Name:fr4 pcb printed circuit board maker in china

Layer: 4

Material:Fr4

Surface finish:HASL lead free

Copper weight:1OZ

Thickness:0.8mm

Key Words:circuit board maker

Solder mask: Green

Silkscreen:White

Min line:5mil

Min hole:0.3mm

Packaging: 1.Inner packing :anti-static bag such as red or white bubble bag. Outer packing: standard carton.

2.Protect product with polyfoam and multi-layer paperboard.

3.We can pack as your requirements.

FR4 4 layer multilayer printed circuit board maker from Shenzhen,China

PCB printed circuit board Superiority

1.High efficiency&Experience

We can provide one stop service.Established in 2009, with many years hard-working and constant innovation,we have

grown up into a professional PCB&PCBA manufacturer. We have our own independent research and development

department and sophisticated quality control system.

2.PCB Quality

Our product are manufactured according to the UL/Rohs standards to insure quality assemblies from start to finish. Whether

it's a simple custom or not.Product or a complex turnkey production run, We will adhere to the highest quality standards.

3.Protecting your interests

Protecting your Intellectual Property is job one! Our staff of trained professionals are all working under a strict confidentiality contract and treat your important documentation as they would their own.

4.Our service

We can provide 24hours service for you. We pride ourselves on our ability to custom tailor programs around our customers'

needs.We take time to listen to your unique business needs and then set out to surpass them

Printed circuit boards maker in china:

We’ll return the tooling cost and give discount for repeat order more than 3 square meters.

Within 6 hours, quotations and suggestions can be given after checking the gerber.

If you have schematic without gerber, pleasure to design it for you.

If you’d like change two boards into one for simplifying, pls.inform us details.

What service can you provide?

We can provide printed circuit board gerber file design,Copy and Clone,OEM

and ODM service.

Not only produce PCB,PCB Assembly,but also design service

ONESEINE'S STANDARD FR-4 MATERIAL PROPERTIES

High Glass Transition Temperature (Tg) (150Tg or 170Tg)

High Decomposition Temperature (Td) (> 345º C)

Low Coefficient of Thermal Expansion (CTE) ((2.5%-3.8%)

Dielectric Constant (@1 GHz): 4.25-4.55

Dissipation Factor (@ 1 GHz): 0.016

UL rated (94V-0, CTI = 3 minimum)

Compatible with standard and lead-free assembly.

Laminate thickness available from 0.005” to 0.125”

Pre-preg thicknesses available (approximate after lamination):

(1080 glass style) 0.0022”

(2116 glass style) 0.0042”

(7628 glass style) 0.0075”

FR4 PCB Applications:

FR-4 is a common material for printed circuit boards (PCBs). A thin layer of copper foil is typically laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as copper clad laminates. The copper thickness or copper weight can vary and so is specified separately.

FR-4 is also used in the construction of relays, switches, standoffs, busbars, washers, arc shields, transformers and screw terminal strips.

Here are some key aspects related to the thermal stability of FR4 PCBs:

The thermal stability of FR4 PCBs refers to their ability to withstand and operate under different temperature conditions without experiencing significant degradation or performance issues.

FR4 PCBs are designed to have good thermal stability, meaning they can handle a wide temperature range without warping, delaminating, or suffering from electrical or mechanical failures.

Glass Transition Temperature (Tg): Tg is an important parameter that characterizes the thermal stability of FR4. It represents the temperature at which the epoxy resin in the FR4 substrate undergoes a transition from a rigid state to a more flexible or rubbery state. FR4 PCBs typically have a Tg value around 130-180°C, which means they can withstand elevated temperatures without significant changes in their mechanical properties.

Coefficient of Thermal Expansion (CTE): CTE is a measure of how much a material expands or contracts with changes in temperature. FR4 PCBs have a relatively low CTE, which ensures that they can withstand thermal cycling without excessive stress or strain on the components and solder joints. The typical CTE range for FR4 is around 12-18 ppm/°C.

Thermal Conductivity: FR4 itself is not highly thermally conductive, which means it is not an excellent heat conductor. However, it still provides adequate heat dissipation for most electronic applications. To enhance the thermal performance of FR4 PCBs, additional measures can be taken, such as incorporating thermal vias or using additional heat sinks or thermal pads in critical areas to improve heat transfer.

Soldering and Reflow Processes: FR4 PCBs are compatible with standard soldering and reflow processes commonly used in electronic assembly. They can withstand the elevated temperatures involved in soldering without significant damage or dimensional changes.

It's important to note that while FR4 PCBs have good thermal stability, they still have limits. Extreme temperature conditions, such as very high temperatures or rapid temperature changes, can potentially cause stress, delamination, or other issues. Therefore, it's important to consider the specific operating environment and choose appropriate materials and design considerations accordingly.

FR4 PCBs are known for their excellent thermal stability, high mechanical strength, and resistance to moisture and chemicals. These properties make them suitable for a wide range of applications, including consumer electronics, telecommunications, automotive, industrial equipment, and more.

The FR4 material consists of a thin layer of copper foil laminated onto a substrate made of woven fiberglass cloth impregnated with epoxy resin. The copper layer is etched to create the desired circuit pattern, and the remaining copper traces provide the electrical connections between components.

The FR4 substrate offers good dimensional stability, which is important for maintaining the integrity of the circuitry over a wide range of temperatures. It also has low electrical conductivity, which helps prevent short circuits between adjacent traces.

In addition to its electrical properties, FR4 has good flame retardant properties due to the presence of halogenated compounds in the epoxy resin. This makes FR4 PCBs suitable for applications where fire safety is a concern.

Overall, FR4 PCBs are widely used in the electronics industry due to their excellent combination of electrical performance, mechanical strength, thermal stability, and flame retardancy.