Diameter 2 Inch Molybdenum Copper Alloy Disc Heat Sink Copper Molybdenum Alloy Electrical And Thermal Conductivity

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2" Diameter Molybdenum Copper Alloy Disc Heat Sink


1. Description of Molybdenum Copper Alloy Disc Heat Sink Diameter 2'':


Molybdenum copper allloy disc heat sink is a composite material of molybdenum and copper, a good substitute for copper, tungsten and copper applications. Molybdenum-copper alloy combines the advantages of copper and molybdenum, high strength, high specific gravity, high temperature resistance, arc ablation resistance, good electrical and thermal conductivity, and good processing performance. Using high-quality molybdenum powder and oxygen-free copper powder, applying isostatic pressing (high temperature sintering-copper infiltration), the structure is fine, the arc breaking performance is good, the electrical conductivity is good, the thermal conductivity is good, and the thermal expansion is small.


2. Common size of Molybdenum Copper Alloy Disc Heat Sink Diameter 2'':

Diameter:2”(50.8mm),4“(101.6mm),6”(152.4mm),8“(203.2mm)

Thickness:0.12mm,0.3mm,0.5mm,2.0mm



3. Parameters of Molybdenum Copper Alloy Disc Heat Sink Diameter 2'':

Alloy grade
MoCu10
MoCu15
MoCu20
MoCu25
MoCu40
Thermal
conductivity
≥150
≥160
≥170
≥180
Thermal
expansion rate
5.6+/-1.5
6.7+/-1.5
7.4+/-1.5
7.9+/-2
8.0+/-3
Alloy grade
MoCu10
MoCu15
MoCu20
MoCu25
MoCu40
Density
≥9.91
≥9.83
≥9.75
≥9.70
≥9.3

4. Process method of Molybdenum Copper Alloy Disc Heat Sink Diameter 2'':


1.)Preparation method of copper molybdenum alloy - liquid phase sintering method


Molybdenum-copper mixed powder is sintered in liquid phase at 1300-1500° after compression molding. The materials prepared by this method have poor uniformity, many closed voids, and the density is usually lower than 98%. It can improve the sintering activity, thereby improving the density of tungsten-copper and molybdenum-copper alloys. However, nickel activated sintering will significantly reduce the electrical and thermal conductivity of the material, and the introduction of impurities in mechanical alloying will also reduce the conductivity of the material; the oxide co-reduction method to prepare powders is cumbersome in the process, low in production efficiency, and difficult to mass produce.


2.)Preparation method of copper-molybdenum alloy - tungsten and molybdenum framework infiltration method


First, tungsten powder or molybdenum powder is pressed into shape, and sintered into a tungsten and molybdenum skeleton with a certain porosity, and then infiltrated with copper. This process is appropriate for low-copper-content tungsten copper and molybdenum copper products. Compared with molybdenum copper, tungsten copper has the advantages of small mass, easy processing, linear expansion coefficient, thermal conductivity and some main mechanical properties equivalent to tungsten copper. Although the heat resistance is not as good as that of tungsten copper, it is better than some current heat-resistant materials, so the application prospect is better. Because the wettability of molybdenum-copper is worse than that of tungsten-copper, especially when preparing molybdenum-copper with low copper content, the density of the material after infiltration is low,As a result, the material's ability to be airtight, electrically conductive, and thermally conductive is insufficient. Its application is restricted.


5. Application of Molybdenum Copper Alloy Disc Heat Sink Diameter 2'':


It is used to manufacture military high-power microelectronic devices as heat sink sealing material and aluminum oxide ceramic sealing and molybdenum-copper alloy rods for structural materials. It is also suitable for high thermal conductivity constant expansion sealing heat in the manufacture of civil high-power microelectronic devices. Molybdenum copper alloy rod for sinking.



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China Diameter 2 Inch Molybdenum Copper Alloy Disc Heat Sink Copper Molybdenum Alloy Electrical And Thermal Conductivity supplier

Diameter 2 Inch Molybdenum Copper Alloy Disc Heat Sink Copper Molybdenum Alloy Electrical And Thermal Conductivity

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