Grey Thermal Gap Filler Pad Material Silicone Based Thermal Conductivity
Brand Name:Laird
Certification:ROHS,SGS,ISO
Model Number:A184XX-XX
Minimum Order Quantity:1000pcs
Delivery Time:1-3 weeks
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
D202-A208, Building D, Guanghong Meiju, No. 163, Pingxin North Road, Hehua Community, Pinghu Street, Longgang District, Shenzhen, Guangdong, China
Supplier`s last login times:
within 25 hours
Product Details
Company Profile
Product Details
Tflex HD7.5 Silicone Based Thermal Gap Filler Thermal Pad Laird Thermal Conductivity 7.5W/Mk Grey High Deflection
Product Description
Laird’s Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series. With a thermal conductivity of 7.5W/ mk, Tflex™ HD7.5 is designed to provide superior pressure versus deflection characteristics. The material will provide minimal stress on components during application while maintaining low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
Features and Benefits
·7.5 W/mK thermal conductivity soft pad
·Low pressure versus deflection
·Minimizes board and component stress
·Low outgassing and oil bleeding
Industries
- Aerospace/Defense
- Automotive
- Consumer
- Industrial
- Telecom/Datacom
Applications
- Automotive ADAS
- Automotive Electronics
- Automotive Infotainment
- Automotive Powertrain/ECUs
- Drones/Satellites
- Gaming Systems
- Instrumentation
- Notebooks/Tablets/Portable Devices
- Routers
- Smart Home Devices
- Wireless infrastructure
About Us: ZSUN TECH
Brand Advantage:
ZSUN consists of a professional team with an average of over 10 year of expertise in the field of electronic components.
An advanced enterprise specializing in the research, development, production, and sales of EMC components, connectors, cables, and integrated circuits (ICs).
Professional EMC products and services, including EMC component selection, EMC simulation, EMC training, and EMC corrective testing services.
ZSUN is a senior enterprise specializing in the research and development, production and sales of EMC components, connectors, cables and Integrated Circuits (ICs). Its headquarter is located in Shenzhen. It consists of a professional team with an average of over 10 year of expertise in the field of electronic components.
The main products include: high current power inductors, Moding power choke, NR inductors, SMD power inductors, DIP inductors, Rod inductors, DC& signal common mode choke, AC common mode choke, transformers , Board-to-board connectors, wire-to-board connectors, communication interfaces, terminals, European connectors, crimp terminals and high-speed connectors, etc., are widely used in industrial control, automotive electronics, medical electronics, new energy motors, communication equipment , digital power amplifier, financial electronics, power system, cables, Integrated Circuits (ICs) and other fields.
ZSUN is committed to build a one-stop electronic components supply platform, allowing customers to enjoy the most professional EMC products and services, namely EMC components selection, EMC simulation, EMC training and EMC rectification &testing services. With advanced management system, strong development capabilities and excellent products Quality and perfect service, ZSUN has become a supplier of electronic components for many well-known enterprises at home and abroad.
Contact Us:
Sales Manager: Rose
Email: Rose@zsun-chips.com
Grey Thermal Gap Filler Pad Material Silicone Based Thermal Conductivity
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