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1,Description:
Material: Tungsten copper alloy plates are composed of a mixture of tungsten and copper. The alloy combines the high strength and thermal conductivity of tungsten with the excellent electrical conductivity of copper.
Composition: Tungsten copper alloy plates typically have a tungsten content ranging from 70% to 90%, with the remaining portion being copper. Different compositions can be tailored to meet specific requirements for thermal and electrical properties.
High Strength: Tungsten copper alloy plates exhibit high strength and hardness, making them suitable for applications requiring resistance to wear, deformation, and high mechanical stresses.
Thermal Conductivity: Tungsten copper alloy plates possess good thermal conductivity, allowing for efficient heat dissipation and thermal management in various applications.
Electrical Conductivity: Tungsten copper alloy plates have excellent electrical conductivity, making them suitable for electrical and electronic applications that require both high strength and good electrical performance.
2,Specifications:
Physical Property | Description |
---|---|
Composition | Tungsten and copper alloy |
Tungsten Content | 70% - 90% |
Copper Content | 10% - 30% |
Density | 14.0 - 16.5 g/cm³ |
Hardness | 200 - 400 HB (Brinell Hardness) |
Thermal Conductivity | 180 - 230 W/m·K |
Electrical Conductivity | 25 - 90% IACS (International Annealed Copper Standard) |
Coefficient of Thermal Expansion | 6.5 - 9.0 x 10^-6 /K |