Diamond Grinder Blade Resin Bond Abrasives For Sapphire Ingot

Brand Name:CAEC
Certification:ISO9001, ISO14001, OHSAS18001
Model Number:1A1, 14A1
Minimum Order Quantity:One piece
Delivery Time:7-10 days
Place of Origin:Henan, China
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Location: Hainan Hainan China
Address: Room 701-702, Dihao Building, Pearl River Plaza, Haikou City, Hainan Province, China
Supplier`s last login times: within 30 hours
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Product Details

Diamond Grinder Blade Resin Bond Abrasives For Sapphire Ingot


Diamond grinding wheel is used to process and trim the external circle of the sapphire ingot to obtain precise external circle dimensional accuracy and edge shape and the oriented-side plane(OF plane) of sapphire ingot by grinding the reference edge.


Main features

High sharpness---high processing efficiency for hard and brittle materials such as sapphire.

Good elasticity---have a polishing effect, good surface quality of the workpiece.

Stable quality---uniform consumption in use and long service life.


Specification :

Universally specification

Bond

Type

Specification

Resin bond


1A1

14A1

200D-20T-20H-5W

250D-25T-76H-5W

300D-20T-127/203H-5W

300D-40T-127/203H -5W

350D-40T-127/203H -5W

400D-40T-127/203H -5W

Metal bond


66D-8W-56L
Note: the wheel specification can be produced according to customer’s requirement.
China Diamond Grinder Blade Resin Bond Abrasives For Sapphire Ingot supplier

Diamond Grinder Blade Resin Bond Abrasives For Sapphire Ingot

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