3oz 12 Layer Heavy Copper PCB FR4 TG170 PCB EING For BMP Project
Brand Name:Customized
Certification:UL,ISO9001
Minimum Order Quantity:Negotiable
Delivery Time:Negotiable
Payment Terms:T/T
Layer:12L
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Location:
Shenzhen Guangdong China
Address:
Room 401，No.5 Building, Dingfeng Technology Park, Shayi Community, Shajing Town, Bao'an District,Shenzhen,Guangdong Province,China
Supplier`s last login times:
within 48 hours
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12L/BMP project/3oz/FR4/TG170/EING/Resin plugging/hole plated over/depth drilling
Heavy copper PCB is normally applied to transformer product and BMP power products. It is widely applied the consumer,communication, automotive industry.
1. They required high technology requriement such as:
1) Material:high TG material: Critical RC% and copper foil choose.
2)Copper thickness: heavy copper 3OZ to 10OZ,
3) Special technology burid holes, depth drilling, PI materail used
etc.
4)) Resin plugging+hole plated over,
5)Special soldermask to be taken high voltage.
2. The PCB needs to be tested as following:
1) Resistance test, inductance test, high voltage test and even
capacitance test, Q value etc.
2) Reliability test: CAF test, solderability test,thermal shock test, temperature cycling test etc.
How to know the dielectric thickness can be withstand voltage value? Is the same voltage level with different kind materails?
Call me,let us disscuss their details.
3oz 12 Layer Heavy Copper PCB FR4 TG170 PCB EING For BMP Project
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