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Halogen Free FR4 Industrial PCB Assembly High Density CEM3 Pcb Prototype Service
Industrial PCB Assembly High Density FR4 CEM3 Pcb Prototype Service Assembly
Material | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder
Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc. |
Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm |
Surface finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion
Silver, ENEPIG, Gold Finger |
PCB Max panel size | 1150mm × 560mm |
Layer | Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB:
1-12 Layers |
Min hole size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
PCBA QC | X-ray, AOI Test, Functional Test |
Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity,
Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
Our service | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component
sourcing, PCB manufacturing from 1 to 64 layers |
Sanforized | Buried via, Blind via, Mixed Pressure, Embedded Resistance,
Embedded Capacitance, Local Mixed Pressure, Local High Density,
Back drill, impedance control. |
SMT Capacity | 700Million Points/Day |
DIP Capacity | 0.5Million Points/Day |
Certificate | RoHS/ISO9001/TS16949/UL/ISO14001/ISO13485 |
Welcome | free customzied logo and package |