Custom Multilayer Electronic Circuit Assembly 3.2mm Thickness CEM3 aluminum

Custom Multilayer Electronic Circuit Assembly 3.2mm Thickness CEM3 Aluminum

China Custom Multilayer Electronics PCB Assembly Company PCBA Manufacturing Design Keyboard PCB

Focus on the research and development of high-precision multi-layer boards and special boards, as well as PCB urgent proofing and production of small and medium-sized batches of circuit board proofing, PCB proofing, circuit board proofing

Our manufacturing equipment: The advanced level of the equipment determines the product quality and production efficiency:

Our production capacity

Service

* Small to a medium volume PCB manufacturer

* Multi PCB types manufacturer

* EMS/PCBA/OEM customers reliable PCB partner

* Trustworthy supplier for PCB trading companies

Leadsintec Co., Ltd is an electronics manufacturing service (EMS) provider located in Shenzhen China since 2004. As an ISO 9001 certified electronics contract manufacturer, we offer a full range of PCB, component procurement, PCB assembly, box-build, testing, cables, and accessories services.

Owing to the past over 15 years of rich experience in manufacturing, Leadsintec has gained a fine reputation at home and abroad. Our products are mainly applied in the Consuming, Industrial, Automation, Automotive, Agriculture, Defense & Aerospace, Medical and Security markets.

Our commitment is to assist small and mid-sized customers in reducing their costs by providing total solutions, high-mixed, low, and medium volume services. With our skilled program managers, process engineers, production personnel, and procurement professionals, we are capable to fully understand and surpass your requirements.

Leadsintec’s manufacturing facilities include clean workshops and advanced high-speed SMT lines. Our chip placement precision can reach +0.1MM on integrated circuit parts. It means we can deal with almost all kinds of integrated circuits, such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA. Additionally, we can provide 0201 chip placement, through-hole component insertion, and finished product fabrication, test, and packing.