Electronic Oven PCB Board Assembly 10 Lines HASL FR4 PCBA Board Service

Electronic Oven Printed Circuit Board Assembly PCBA Service

The Global Electric Oven Market is growing at a faster pace with substantial growth rates over the last few years and is estimated that the market will grow significantly in the forecasted period i.e. 2019 to 2026.

Among the outstanding players in the market are DBK Group, LEWCO, ASC Process Systems, France Etuves, Grieve Corporation, Davron Technologies, Wisconsin Oven, Eastman Manufacturing, Harper International, JPW Ovens & Furnaces, Steelman Industries, KERONE, Carbolite Gero, Sistem Teknik, Guangzhou Kewei Microwave Energy, New sail.

Leadsinte is a professional PCB and PCBA manufacturer, we can provide one-stop service from design, PCB/PCBA, manufacturing, components sourcing, eventually box building, etc. Any customer required, we will try our best to achieve.

Factory Introduction:

Leadsintec Co., Ltd is an electronics manufacturing service (EMS) provider located in Shenzhen China since 2004. As an ISO 9001 certified electronics contract manufacturer, we offer a full range of PCB, component procurement, PCB assembly, box-build, testing, cables, and accessories services.

Owing to the past over 15 years of rich experience in manufacturing, Leadsintec has gained a fine reputation at home and abroad. Our products are mainly applied in the Consuming, Industrial, Automation, Automotive, Agriculture, Defense & Aerospace, Medical and Security markets.

Our commitment is to assist small and mid-sized customers in reducing their costs by providing total solutions, high-mixed, low, and medium volume services. With our skilled program managers, process engineers, production personnel, and procurement professionals, we are capable to fully understand and surpass your requirements.

Leadsintec’s manufacturing facilities include clean workshops and advanced high-speed SMT lines. Our chip placement precision can reach +0.1MM on integrated circuit parts. It means we can deal with almost all kinds of integrated circuits, such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA. Additionally, we can provide 0201 chip placement, through-hole component insertion, and finished product fabrication, test, and packing.