

Add to Cart
Item name | Titanium tube target |
Size | OD133*ID125*840 |
Grade | Gr1 |
Packaging | Vacuum package in wooden casex |
Port of place | Xi'an port, Beijing port, Shanghai port, Guangzhou port, Shenzhen port |
Vacuum coating technology is generally divided into two categories,
namely physical vapor deposition (PVD) technology and chemical
vapor deposition (CVD) technology.
Physical vapor deposition technology refers to the method of
directly depositing the plating material on the surface of the
substrate by gasification into atoms and molecules or ionization
into ions by various physical methods under vacuum conditions. Hard
reaction films are mostly prepared by physical vapor deposition,
which uses some physical processes, such as thermal evaporation of
materials or sputtering of atoms on the surface of materials under
ion bombardment, to realize the controllable transfer process of
atoms from the source material to the film. Physical vapor
deposition technology has many advantages, such as good film/base
bonding force, uniform and compact film, controllable film
thickness, wide target, wide sputtering range, thick film can be
deposited, alloy film with stable composition and good
repeatability. At the same time, physical vapor deposition can be
used as the final processing process for HSS and cemented carbide
film tools because the processing temperature can be controlled
below 500℃. Because physical vapor deposition technology can
greatly improve the cutting performance of cutting tools, people
are competing to develop high performance and high reliability
equipment, but also the expansion of its application fields,
especially in the application of high-speed steel, carbide and
ceramic tools for more in-depth research.
Chemical vapor deposition technology is the elemental gas
containing a membrane element or compound supply base, with the aid
of the gas phase or substrate on the surface of a chemical
reaction, on the matrix method of making metal or compound film,
mainly including atmospheric pressure chemical vapor deposition,
low pressure chemical vapor deposition and has both features of CVD
and PVD plasma chemical vapor deposition, etc.
Features
1. Low density and high strength
2. Customized according to the drawings required by customers
3. Strong corrosion resistance
4. Strong heat resistance
5. Low temperature resistance
6. Heat resistance