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iLC212 Uncooled LWIR 256x192 / 12μm Infrared Thermal Module for
Security Thermal Camera
iLC212 uncooled IR imaging module integrates the 256x192 / 12μm
focal plane array wafer level package (WLP) infrared detector and
can capture long-wave infrared (LWIR) spectrum that ranges from 8
to 14μm.
Oriented for fully optimized SWaP-C, the iLC212 thermal camera
module is specially designed for those customers who has strict
requirements about size, weight and cost in the area of security
and surveillance. Due to its miniature size, light weight and very
low price, the iLC212 thermal core greatly meets the customers' low
price demands and shorten developement time and costs for them.
The iLC212 is very suitable to be integrated into surveillance
cameras with wide angle and close range temperature measurement,
such as Hidden Cameras, Digital Camera, Dome Cameras, Box Camera
etc.
- Fully optimized SWaP-C application
- Suitable for various security thermal cameras
- A wide range of thermal imaging applications
- Low Power Consumption
Model | iLC212 |
IR Detector Performance | |
Material | Uncooled Vanadium Oxide |
Resolution | 256×192 |
Pixel Size | 12μm |
Spectral Response | 8μm ~14μm |
NETD | ≤65mK@F1.0@25℃@50Hz |
Image Processing | |
Digital Video | RAW/YUV/BT656; Support USB2.0 Video Transmission; Temperature Measurement Support Parameter Line |
Digital Frame Rate | 25Hz/30Hz |
Image Display | Black-hot/white-hot/Pseudo-color |
Image Algorithm | Nonuniformity Correction (NUC) 3D Image Noise Reduction (3DNR) 2D Noise Reduction (DNS) Dynamic Range Compression (DRC) EE Enhancement |
Start-up Time | ≤3s |
Temperature Measurement | |
Operating Temperature Range | -10℃~+50℃ |
Temperature Measurement Range | -20℃~+150℃, Support Temperature Measurement Range Expansion and Customization |
Temperature Measurement Accuracy | ±3℃/±3% (take the larger value) @23℃±5℃; the Temperature Measurement Distance is 1.5m |
Regional Temperature Measurement | Support Any Area Temperature Measurement, Output Area Maximum Value, Minimum Value and Average Value |
SDK | Windows / Linux Version, Achieve Video Stream Analysis and Gray to Temperature Conversion |
Electrical Interface | |
External Interface | 30pin_HRS Connector Power Input Digital Video RS232-TTL/USB2.0 GPIO etc. |
Communication | RS232-TTL/USB2.0 |
Expansion Component | VPC Board |
PC Software | |
ICC Software | Module Control and Video Display |
Power System | |
Power Supply | DC 3.3V±0.1V |
Power Dissipation | Steady State: 0.70W/3.3V @23±3℃ |
Physical Property | |
Connectors | External Connector Model: DF40C-30DP-0.4V (51), (HRS-Male) Mating Connector Model: DF40C (2.0)-30DS-0.4V (51), (HRS-Female) |
Size | 21mm×21mm×12.8mm (including 3.2mm lens) |
Weight | 8.9g±0.5g (including 3.2mm lens) |
Environmental Adaptability | |
Operation Temperature | -40℃~+70℃ |
Storage Temperature | -45℃~+85℃ |
Humidity | 5%~95%, non-condensing |
Impact & Vibration Resistance | Impact: half sine wave, 40g/11ms, 3-axis, 6-direction Vibration: 5.35grms, 3 axis |
Certification | ROHS2.0/REACH |
Lens | |
Optional Lens | 3.2mm/F1.1, HFOV: 55.6±2.8°; Coating: AR |
The iLC212 thermal imaging module is applied to the field of
security and monitoring, It is suitable to be integrated into the
Hidden Camera, Digital Camera, Dome Camera, Box Camera etc.
1. What is infrared thermal imaging?
Infrared thermal imaging is a kind of method which utilizes
infrared radiation and thermal energy to gather information about
objects. It converts invisible infrared radiation into visible
infrared thermal image with temperature distribution of the target
surface. Different objects and even different parts of the same
object have different radiation ability and infrared reflection
strength.
2. What can infrared imaging be used for?
-Night vision
-Search & rescue
-Non-destructive test
-Epidemic prevention
-Thermography
-Security & monitoring
-Firefighting
…
3. What is thermal imaging module?
A thermal imaging module usually consists of an infrared detector,
infrared lens and hardware electronics with software and algorithm
embedded. It is the minimum unit of a thermal imaging device.