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Prototype printed circuit board (PCB) assemblies also named surface-mount technology (SMT) PCB prototypes, PCBA prototype assembly, PCB sample assembly, etc.
The term prototype PCB Assembly refers to a fast prototype PCBA used to test the function of new electronic designs.
The prototype PCB assembly section of our manufacturing facility has a unique layout that allows for flexible use of both automated and manual parts-loading stations.
Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .
Base material | FR4,High-TG FR4,CEM3,aluminum, High frequency(Rogers,Taconic,Aron,PTFE,) |
Layers | 1-46 |
Copper Thickness | 0.3oz,0.5oz, 1oz, 2oz, 3oz,4oz,5oz, 6oz |
Dielectric Thickness | 0.05mm, 0.075mm, 0.1mm,0.15mm,0.2mm |
board Core Thickness | 0.4mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, |
1.5mm, 2.0mm, 3.0mm and 3.2mm | |
Board Thickness | 0.3mm - 4.0mm |
Thickness Tolerance | +/-10% |
Surface Finishing | HASL lead free,ENIG,Plated Gold,Immersion Gold,OSP |
Solder Mask Color | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
Legend Color | Black, White etc |
Assembly Types | Surface mount |
Thro-hole | |
Mixed technology (SMT & Thru-hole) | |
Single or double sided placement | |
Conformal coating | |
Shield cover assembly for EMI emission control | |
Parts Procurement | Full Turnkey, Partial Turnkey, Kitted / Consigned |
Component types | SMT 01005 or larger |
BGA 0.4mm pitch, POP (Package on Package) | |
WLCSP 0.35mm pitch | |
Hard metric connectors | |
Cable & wire | |
Other Techniques | Free DFM Review |
Box Build Assembly | |
100% AOI test and X-ray test for BGA | |
Components cost-down | |
Function test as custom | |
Protection technology |
PCBA Capability | |||
Material Type | Item | Min | Max |
PCB | Dimension (length,width,height.mm) | 50*40*0.38 | 600*400*4.2 |
Material | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC | ||
Surface finish | HASL,OSP,Immersion gold,Flash Gold Finger | ||
Components | Chip&IC | 1005 | 55mm |
BGA Pitch | 0.3mm | - | |
QFP Pitch | 0.3mm | - |
Service value
Independent quotation system to quickly serve the market
PCB manufacturing
High-tech PCB and PCB assembly production line
Material purchasing
A team of experienced electronic component procurement engineers
SMT post soldering
Dust-free workshop, high-end SMT patch processing
Product Type | Qty | Normal lead time | Quick-turn lead time |
SMT+DIP | 1-50 | 1WD-2WD | 8H |
SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics.
PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box