High Tg FR-4 HASL ENIG OEM HF 6 Layer HDI PCB Board

Brand Name:HNL-PCBA
Certification:ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000
Model Number:PCB Assembly 012
Minimum Order Quantity:1 PC
Delivery Time:1-7days
Payment Terms:T/T, Western Union, L/C, MoneyGram
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Location: Beijing Beijing China
Address: Room 704-3, 7 / F, Building 9, Yard 8, Development Road, Changping District, Beijing
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Product Details

High Tg FR-4 HASL ENIG OEM Multilayer HF 6Layer HDI PCB Board


HDI PCB Board Introduction


HDI PCB is a special type of PCB, and it has the capability of high-density interconnections. In other words, it has more wires or conduction lines per unit area, utilizing the most of the space & offering a compact PCB. But the board functionally isn’t affected.

HDI Board contains blind and buried vias and often contain microvias of 0.006 or less in diameter.

HDI board has higher circuitry density than traditional circuit boards.

All of the other electronic components are mounted on the printed circuit boards(PCBs),which are the foundation.

PCBs have mechanical and electrical attributes,making them for ideal applications. Most PCB’s fabricated are rigid, roughly 90% of the PCB’s manufactured today are rigid boards.


PCB CAPABILITIES

FACTORY CAPABILITIES
No.Items20192020
1HDI CapabilitiesHDI ELIC (4+2+4)HDI ELIC(5+2+5)
2Max layer count32L36L
3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mmCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4Min.Hole SizeLaser 0.075mmLaser 0.05mm
Mechnical 0.15mmMechnical 0.15mm
5Min Line Width/Space0.035mm/0.035mm0.030mm/0.030mm
6Copper Thickness1/3oz-4oz1/3oz-6oz
7Size Max Panel size700x610mm700x610mm
8Registration Accuracy+/-0.05mm+/-0.05mm
9Routing Accuracy+/-0.075mm+/-0.05mm
10Min.BGA PAD0.15mm0.125mm
11Max Aspect Ratio10:110:1
12Bow and Twist0.50%0.50%
13Impedance Control Tolerance+/-8%+/-5%
14Daily Output3,000m2 (Max capacity of equipment)4,000m2 (Max capacity of equipment)
15Surface FinishingENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

The types of HDI PCB


1.through vias from surface to surface,
2.with buried vias and through vias,
3.two or more HDI layer with through vias,
4.passive substrate with no electrical connection,
5.coreless construction using layer pairs
6.alternate constructions of coreless constructions using layer pairs.


Work flow for HDI


Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment


PCB Assembly Process



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Delivery Time


Product TypeQtyNormal lead timeQuick-turn lead time
SMT+DIP1-501WD-2WD8H
SMT+DIP51-2002WD-3WD1.5WD
SMT+DIP201-20003WD-4WD2WD
SMT+DIP≥20014WD-5WD3WD
PCBA(2-4Layer)1-502.5WD-3.5WD1WD
PCBA(2-4Layer)51-20005WD-6WD2.5WD
PCBA(2-4Layer)≥2001≥7WD5WD
PCBA(6-10Layer)1-503WD-4WD2.5WD
PCBA(6-10Layer)51-20007WD-8WD6WD
PCBA(10-HDILayer)1-507WD-9WD5WD
PCBA(10-HDILayer)51-20009WD-11WD7WD

HDI PCB Board Application Field


Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.



Workshop



Common packaging


1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box



Our advantage


1.Service value

Independent quotation system to quickly serve the market

2.PCB manufacturing

High-tech PCB and PCB assembly production line

3.Material purchasing

A team of experienced electronic component procurement engineers

4.SMT post soldering

Dust-free workshop, high-end SMT patch processing


China High Tg FR-4 HASL ENIG OEM HF 6 Layer HDI PCB Board supplier

High Tg FR-4 HASL ENIG OEM HF 6 Layer HDI PCB Board

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