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Components could be mounted or soldered on both sides. The
double-sided assembly is more frequently used in comparison to the
single-sided one. The components are on both sides. We have the
equipment to assembly double sided PCBs.
Of the double-sided PCB assembly process, the surface-mount
components will be placed on both sides of the PCB followed by
Through-hole placement. The through-hole component placement can
only be done after the completion of the surface mounting process
on both sides of the PCB.
FACTORY CAPABILITIES | |||
No. | Items | 2019 | 2020 |
1 | HDI Capabilities | HDI ELIC (4+2+4) | HDI ELIC(5+2+5) |
2 | Max layer count | 32L | 36L |
3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
4 | Min.Hole Size | Laser 0.075mm | Laser 0.05mm |
Mechnical 0.15mm | Mechnical 0.15mm | ||
5 | Min Line Width/Space | 0.035mm/0.035mm | 0.030mm/0.030mm |
6 | Copper Thickness | 1/3oz-4oz | 1/3oz-6oz |
7 | Size Max Panel size | 700x610mm | 700x610mm |
8 | Registration Accuracy | +/-0.05mm | +/-0.05mm |
9 | Routing Accuracy | +/-0.075mm | +/-0.05mm |
10 | Min.BGA PAD | 0.15mm | 0.125mm |
11 | Max Aspect Ratio | 10:1 | 10:1 |
12 | Bow and Twist | 0.50% | 0.50% |
13 | Impedance Control Tolerance | +/-8% | +/-5% |
14 | Daily Output | 3,000m2 (Max capacity of equipment) | 4,000m2 (Max capacity of equipment) |
15 | Surface Finishing | HASL lead free/ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD | |
16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI |
PCBA Capability | ||||||
Material type | PCB | Components | ||||
Item | Dimension (Length, width,height. mm) | Material | Surface finish | Chip&IC | BGA Pitch | QFP Pitch |
Min | 50*40*0.38 | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC | HASL, OSP, Immersion gold, Flash Gold Finger | 1005 | 0.3mm | 0.3mm |
Max | 600*400*4.2 |
Our SMT capabilities:
SMT Assembly: SMT provides a flexible high technology.
These solutions include:
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines
Our DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products
with test stations
High temperature / low temperature aging test furnace B-4 for
products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
Haina lean Electronics Co.,Ltd is a competitive China customize
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machine production prototypes and samples from our factory.
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PCB Assembly Process
1.Solder Paste stenciling---2.Surface Mount Technology (Pick and
Place)---3.Reflow Soldering---4.Inspection and Quality
Control---5.Through-Hole Component Insertion (DIP
Process)---6.Final Inspection and Functional Test
1.Service value
Independent quotation system to quickly serve the market
2.PCB manufacturing
High-tech PCB and PCB assembly production line
3.Material purchasing
A team of experienced electronic component procurement engineers
4.SMT post soldering
Dust-free workshop, high-end SMT patch processing
Printed circuit boards And PCB Assembly are mainly used for many
communication industry, medical equipments, consumer electronics
and automobile industry ,automotive electronics , audio and video,
optoelectronics, robotics, hydroelectric power, aerospace,
education, power supply, printer etc industries.
Our Workshop
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box