2 Sided Copper Clad PCB Board PCB Component Assembly

Brand Name:HNL-PCBA
Certification:ISO9001,IS16949, ISO14001,ROHS ,IPC-A , UL, QC080000
Model Number:PCB Component Assembly
Minimum Order Quantity:1 PC
Delivery Time:1-7days
Payment Terms:T/T, Western Union, L/C, MoneyGram
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Location: Beijing Beijing China
Address: Room 704-3, 7 / F, Building 9, Yard 8, Development Road, Changping District, Beijing
Supplier`s last login times: within 2 hours
Product Details Company Profile
Product Details

FR-4 Double Sided Copper Clad PCB Board PCB Component Assembly

Introduction


Components could be mounted or soldered on both sides. The double-sided assembly is more frequently used in comparison to the single-sided one. The components are on both sides. We have the equipment to assembly double sided PCBs.
Of the double-sided PCB assembly process, the surface-mount components will be placed on both sides of the PCB followed by Through-hole placement. The through-hole component placement can only be done after the completion of the surface mounting process on both sides of the PCB.

PCB CAPABILITIES

FACTORY CAPABILITIES
No.Items20192020
1HDI CapabilitiesHDI ELIC (4+2+4)HDI ELIC(5+2+5)
2Max layer count32L36L
3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mmCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4Min.Hole SizeLaser 0.075mmLaser 0.05mm
Mechnical 0.15mmMechnical 0.15mm
5Min Line Width/Space0.035mm/0.035mm0.030mm/0.030mm
6Copper Thickness1/3oz-4oz1/3oz-6oz
7Size Max Panel size700x610mm700x610mm
8Registration Accuracy+/-0.05mm+/-0.05mm
9Routing Accuracy+/-0.075mm+/-0.05mm
10Min.BGA PAD0.15mm0.125mm
11Max Aspect Ratio10:110:1
12Bow and Twist0.50%0.50%
13Impedance Control Tolerance+/-8%+/-5%
14Daily Output3,000m2 (Max capacity of equipment)4,000m2 (Max capacity of equipment)
15Surface FinishingHASL lead free/ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI


PCBA CAPABILITIES

PCBA Capability
Material typePCBComponents
ItemDimension (Length, width,height. mm)MaterialSurface finishChip&ICBGA PitchQFP Pitch
Min50*40*0.38FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPCHASL, OSP, Immersion gold, Flash Gold Finger10050.3mm0.3mm
Max600*400*4.2  


Our SMT capabilities:

SMT Assembly: SMT provides a flexible high technology.
These solutions include:
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines

Our DIP function:

A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products with test stations
High temperature / low temperature aging test furnace B-4 for products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
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PCB Assembly Process

1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test

Our advantage


1.Service value
Independent quotation system to quickly serve the market
2.PCB manufacturing
High-tech PCB and PCB assembly production line
3.Material purchasing
A team of experienced electronic component procurement engineers
4.SMT post soldering
Dust-free workshop, high-end SMT patch processing





Double Side PCB Assembly Application Field


Printed circuit boards And PCB Assembly are mainly used for many communication industry, medical equipments, consumer electronics and automobile industry ,automotive electronics , audio and video, optoelectronics, robotics, hydroelectric power, aerospace, education, power supply, printer etc industries.



Our Workshop




Common packaging


1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box



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China 2 Sided Copper Clad PCB Board PCB Component Assembly supplier

2 Sided Copper Clad PCB Board PCB Component Assembly

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