6 Layer 3 Mil Smd Pcb Smt Assembly For Communication

Brand Name:HNL-PCBA
Certification:ISO9001,IS16949, ISO14001,ROHS ,IPC-A ,QC080000
Model Number:PCBA-01
Minimum Order Quantity:1 PC
Delivery Time:1-7days
Payment Terms:T/T, Western Union, L/C, MoneyGram
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Active Member
Location: Beijing Beijing China
Address: Room 704-3, 7 / F, Building 9, Yard 8, Development Road, Changping District, Beijing
Supplier`s last login times: within 2 hours
Product Details Company Profile
Product Details

6 Layer 3 Mil SMD SMT PCB Assembly For communication


Printed Circuit SMT Board Assembly Introduction

Haina lean Electronics is a one-stop EMS supplier integrating PCB design, PCB manufacturing, Component sourcing and PCB assembly.
The company is specialized in electronic products supporting processing services, mainly to undertake circuit board design, layout production, components procurement, PCB plate making, circuit board welding assembly debugging and other OEM/ODM services.


Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .


PCB CAPABILITIES

No.Items
1HDI CapabilitiesHDI ELIC(5+2+5)
2Max layer count36L
3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness0.3-3.5mm
4Min.Hole SizeLaser 0.05mm
Mechnical 0.15
5Min Line Width/Space0.030mm/0.030mm
6Copper Thickness1/3oz-6oz
7Size Max Panel size700x610mm
8Registration Accuracy+/-0.05mm
9Routing Accuracy+/-0.05mm
10Min.BGA PAD0.125mm
11Max Aspect Ratio10:01
12Bow and Twist0.50%
13Impedance Control Tolerance+/-5%
14Daily output4,000m2 (Max capacity of equipment)
15Surface FinishingENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

PCBA CAPABILITIES


PCBA Capability
Material TypeItemMinMax
PCBDimension (length,width,height.mm)50*40*0.38600*400*4.2
MaterialFR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finishHASL,OSP,Immersion gold,Flash Gold Finger
ComponentsChip&IC100555mm
BGA Pitch0.3mm-
QFP Pitch0.3mm-

Our advantage

Service value

Independent quotation system to quickly serve the market

PCB manufacturing

High-tech PCB and PCB assembly production line

Material purchasing

A team of experienced electronic component procurement engineers

SMT post soldering

Dust-free workshop, high-end SMT patch processing



Delivery Time


Product TypeQtyNormal lead timeQuick-turn lead time
SMT+DIP1-501WD-2WD8H
SMT+DIP51-2002WD-3WD1.5WD
SMT+DIP201-20003WD-4WD2WD
SMT+DIP≥20014WD-5WD3WD
PCBA(2-4Layer)1-502.5WD-3.5WD1WD
PCBA(2-4Layer)51-20005WD-6WD2.5WD
PCBA(2-4Layer)≥2001≥7WD5WD
PCBA(6-10Layer)1-503WD-4WD2.5WD
PCBA(6-10Layer)51-20007WD-8WD6WD
PCBA(10-HDILayer)1-507WD-9WD5WD
PCBA(10-HDILayer)51-20009WD-11WD7WD

Printed Circuit SMT Board Assembly Application Field


Assembled Printed Circuit Boards are mainly used for many communication industry, medical equipments, consumer electronics and automobile industry ,automotive electronics , audio and video, optoelectronics, robotics, hydroelectric power, aerospace, education, power supply, printer etc industries.



Workshop



Partners



Common packaging


PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box



China 6 Layer 3 Mil Smd Pcb Smt Assembly For Communication supplier

6 Layer 3 Mil Smd Pcb Smt Assembly For Communication

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