High precision silicon carbide components for semiconductor processes and optical machinery equipment
Brand Name:ZG
Certification:CE
Model Number:MS
Minimum Order Quantity:1 piece
Delivery Time:3 working days
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
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Location:
Zhengzhou Henan China
Address:
No. 26, Dongqing Street, High-tech Zone, Zhengzhou ,Henan, China
Supplier`s last login times:
within 48 hours
Product Details
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Product Details
High precision silicon carbide components for
semiconductor processes and optical machinery equipment
Silicon carbide robotic arm is formed by isostatic pressing process and sintering at high temperature. According to the requirements of the user's design drawings, the size, thickness and shape can be finished to meet the specific requirements of the user.
Typical applications
- Used for wafer transmission in various semiconductor manufacturing processes.
Features and advantages
- Accurate size and thermal stability
- High specific stiffness and excellent thermal uniformity, long-term use is not easy to bend deformation;
- The wafer has a smooth surface and good wear resistance, allowing safe handling of the wafer without particle contamination.
- Coresic ® SP resistivity silicon carbide in 106-108 Ω, nonmagnetic, accord with the normative requirement of ESD resistance; It prevents static electricity from accumulating on the surface of the wafer.
- Good thermal conductivity, low coefficient of expansion.
Specifications
- According to customer's drawings, we can process different shapes and sizes of arms.
Silicon carbide vacuum chuck is formed by isostatic pressing process and sintering at high temperature. According to the requirements of the user's design drawings, the size, thickness and shape can be finished to meet the specific requirements of the user.
Typical applications
In semiconductor manufacturing, extremely thin wafers are placed on silicon carbide vacuum suckers, connected to a vacuum generator, and the wafers are fixed by vacuum suction.
Used in lithography, etching, laser processing, wafer testing and other processes.
Features and advantages
Accurate size and thermal stability
Good thermal conductivity, low coefficient of expansion and temperature uniformity
Extremely high wear resistance and surface finish, fine pore size and uniform distribution, can be uniformly adsorbed to all areas of the wafer
Excellent acid and alkali corrosion resistance
Plasma impact resistance
Specifications
Can be customized according to customer drawings processing.
High precision silicon carbide components for semiconductor processes and optical machinery equipment
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