ISO 9001 Heat Proof Jedec IC Trays Protect Chip ESD PPE MPPO Standard
Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:Jedec standard tray 322.6*135.9*7.62&12.19mm
Minimum Order Quantity:1000 pcs
Delivery Time:5~8 working days
Payment Terms:T/T
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Location:
Shenzhen Guangdong China
Address:
Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
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Product Details
ISO 9001 Heat Proof Jedec IC Trays Protect Chip ESD PPE MPPO
ESD PPE MPPO Standard Jedec Trays With Different Cavities Can Be
Customized For IC Chips
Jedec standard matrix trays or jusut Jedec trays for short are a
standard-defined tray used across the entire semiconductor and
microelectronics industry for transporting, handling, and storing
complete chips (integrated circuits) and various other components.
JEDEC trays featured fixed-size slots for placement of chips Trays
are typically made of strong inflexible plastic.
The design of the structure and shape in line with Jedec international standards can also perfectly meet the requirements of the carriing components or IC of the tray, carriing function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, improve work efficiency.
The Flat cells in the center area of each tray is designed for automatic equipment to allow the use of vacuum picking up tools. If it is necessary to cancel in special cases, we can also change the design according to your requirements at the beginning of the design.
The tray has a 45-degree chamfer to provide the visual indicator of Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes and maximize the protection of the chip.
Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as
possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us
with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear
description of the IC or component.Provide one-stop service from
design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is
the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply
with the international JEDEC standards, to ensure 100% qualified
rate.
ISO 9001 Heat Proof Jedec IC Trays Protect Chip ESD PPE MPPO Standard
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