BGA IC Packaging Black Jedec Matrix Trays ESD Stable Surface

Brand Name:Hiner-pack
Certification:ISO 9001 ROHS SGS
Model Number:HN1837
Minimum Order Quantity:1000 pcs
Delivery Time:5~8 working days
Payment Terms:T/T
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Verified Supplier
Location: Shenzhen Guangdong China
Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN
Supplier`s last login times: within 1 hours
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Product Details
BGA IC Packaging Black Jedec Matrix Trays ESD Stable Surface
BGA IC Packaging Solution ESD Stable Surface Resistance Matrix Tray

Jedec Tray/Matrix Tray/IC Tray/ESD Packing Tray

Antistatic trays are among those things that should top your must-have list for ESD control and management.
The trays provide critical protection to sensitive electronic components by preventing ESD damage during shipping, storage and/or handling.

Material Description


ESD Conductive Material
Also can be antistatic or Conductive and can be normal one .

Application:

IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc


What is ESD safe material?
ESD-safe materials are created by combining an optimized base material – often ABS, PET-G, or PC – with an additive. The base material will determine the properties of the finished part, such an flexibility or strength. This means choosing the right base material for your application is an important decision.

UsagePackaging of Electronic Components,Optical device,
FeatureESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
MaterialMPPO.PPE.ABS.PEI.IDP...etc
ColorBlack.Red.Yellow.Green.White and custom color
SizeCustomized size, rectangle,circle shape
Mold typeInjection Mold
DesignOriginal sample or we can create the designs
PackingBy Carton
SampleSample time: after draft confirmed and payment arranged
Sample charge: 1. Free for stock samples
2. Custom Tray negotiated
Lead Time5-7 Working days
The exact time should according to the ordered quantity


Detail Description

Outline Line Size322.6*135.9mmBrandHiner-pack
ModelHN 1837Package TypeBGA IC
Cavity Size10.8*5.3*1.1mmMatrix QTY35*9=315PCS
MaterialPPEFlatnessMAX 0.76mm
ColorBlackServiceAccept OEM,ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateROHS


FAQ


1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept
EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

China BGA IC Packaging Black Jedec Matrix Trays ESD Stable Surface supplier

BGA IC Packaging Black Jedec Matrix Trays ESD Stable Surface

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