ROHS Black Plastic Waffle Pack Chip Trays For Bare Die

ROHS Black Plastic Waffle Pack Chip Tray for Bare Die

The waffle pack is a carrier for loading and transporting the small bare chips. It is often a plastic tray with an evenly distributed matrix of pockets, suitable for a particular chip. The waffle pack got its name from its resemblance to a breakfast waffle. In the process of packaging, the factories usually use tweezers or automation equipment for loading. After the product is loaded, we will cover the the products with tyvek paper, and finally use matching lids and clamps to secure waffle pack.

Details of the HN21114 Waffle Pack

HN21114 Waffle Pack is made of PC.The material has good stability and can protect customers' electronic products well. The matrix design of 13*7 can also load more customers' products. In addition, multiple trays can overlap, increasing the storage of electronic components, PCB board and dust-free workshop parts, thus saving transportation costs.

Over the years, the chip tray produced by our company are exported to famous customers at home and abroad. With rich experience in injection molding industry, we also provide customers with the most suitable packaging service. Achieve the most reasonable loading according to the size and manufacturing requirements provided by the customer.

Application of the HN21114 Chip Tray

IC Packaging Delivery Systems Electronic Component

Microelectronic Devices Semiconductor Wafer Bare

Our Service

1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.

FAQ

Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.

Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/