Injection Moulding Black Square Waffle Pack Loading IC Chip Tray 168PCS

Black Square Waffle Pack Chip Tray 168PCS For Loading IC Chips

The waffle pack is used to provide clean, secure packaging for bare die and other microelectronics devices. There are a wide variety of chip trays, which come in a variety of sizes and materials.The commonly used chip tray are 2″ x 2″ square trays or 4″ x 4″ square trays. In addition, Hiner-pack can also provide the customized service for your need. We are the quality manufacture and have nearly 14 years experience in waffle pack.To provide customers with high-quality tray is our service tenet.

The Details of the HN22020 Waffle Pack

The Waffle pack is classified according to the size of the pockets, and customers choose the right tray according to the size of their products. HN22020 chip tray has a pocket size of 1.0*1.1*0.45mm,which is made of PC, a commonly used industrial raw material. The structure of the product is consolidated with strong stability. In addition, the 45 degree chamfer design is recognized by automated equipment, allowing multiple trays to overlap. This design greatly increases the storage of products, thus saving transportation and storage costs.

Compared with traditional packaging, our trays are smaller and lighter. The 14*12 matrix design can also accommodate more products. At the same time, all our products are in line with ROHS international environmental protection standards. The raw materials can be recycled and easily degraded after waste, customers don't have to worry about environmental pollution at all.

Application of HN22020 Chip Tray

Semiconductor Display Technology

Electronic Component Packaging Optical Device Packaging

Advantages

1. Light weight, saving transportation and packaging costs.
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine.
3. The material has excellent conductivity and can permanently eliminate static electricity (black).
4. Color: yellow/gray/black/transparent (contact customer service).

5.The appearance of the product is matte with flatness<0.2mm.
6. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, cost saving.

FAQ

Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9001 Quality Management System.

Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.

Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days around.

Q4: How about batch order production?
Ans: Normally 5-8days or so.

Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9001 standard and ruled by our QC staff.

Hiner-pack was founded in 2013,it is a high-tech enterprise which is integrated Design,R&D,Manufacturing,Sales of IC packaging and testing as well as semiconductive wafer fabrication process in automated handling,carrying,transportation to provide customers turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions.Hiner-pack has mastered special processing technique and manufacturing in semiconductor packaging raw material field.Owned a lot of inventions and practical new patents.Through years of unremitting efforts,Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to launch,and to solve the customer demand for high quality products.

Learn more through our official website https://www.hiner-pack.com/english/