Black Chip Die BGA QFN ESD Packaging Tray For Optoelectronic Devices Tray

ESD Black Chip Die BGA QFN Packaging Tray For Optoelectronic Devices Tray

Antistatic electronic JEDEC trays are special plastic packaging materials that can effectively prevent the generation of static electricity and thus protect electronic products from static damage.

JEDEC trays are also a common plastic packaging material used for packaging, transporting and displaying a variety of products, such as IC manufacturing, electronic parts, D-RAM, precision instruments, etc. TRAY are usually designed with a depth that can accommodate multiple products and can be stacked for easy transportation and storage.

JEDEC Tray Parameters

Shenzhen Hiner Technology Co.,LTD is a professional semiconductor chip packaging factory, dedicated to producing high quality anti-static work tray, JEDEC tray and other plastic packaging materials.

Our anti-static work trays and TRAY trays can be customized, including special design or logo. In addition, we also accept OEM manufacturing commissioned by the original manufacturers to meet the needs of different customers. Our products are widely used in different industries such as electronic, medical, industrial, etc., providing customers with high quality packaging solutions.

Our anti-static trays are not only of high quality, but also have good cushion packaging and anti-dust effect, which can effectively protect the products from damage and pollution. Our products comply with international environmental requirements and provide customers with green and sustainable packaging solutions.

Customer FAQ

Question 1: Are you a trading company or a manufacturer?
A: We are a manufacturer with 13 years experience in Shenzhen China factory. We are dedicated to integrated services such as molding design, mold manufacturing, injection molding processing, and product shipping;

in addition, we provide semiconductor chip packaging solutions for enterprises and applications. We have technicians with over 20 years of experience and more than 100 employees, as well as a 2,000 square meter factory.

Question 2: How do I get a quote?
Answer: We will provide a quote within 24 hours. In order to provide an accurate and immediate quote, please provide the following details:
(1) Documents and drawings.(3D drawings of the product. STP format is best)
(2) Material/temperature resistance/cycle time requirement.
(3) Specification.
(4) Quantity.
(5) Other requirements.

Question 3: What if we don't have drawings?
A: We can provide you with a preliminary free design of the product size, when you agree with our offer, you can send us the sample shipping costs borne by us.

Our engineers can provide you with better solutions and product 3D drawings according to your products!

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/