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Mobile Charge Motherboard Electronic Circuit PCB Soldering Service
Our company specialized in:
Researching & developing
Designing and manufacturing
Product designing,
Electronic circuit hardware designing
PCB circuit designing
Microcontroller researching and development
PC software programming
Product exterior industrial designing
Prototype developing
Circuit board manufacturing
SMT chip enhancing
PCB capability:
Specification | |
Numbr of Layer | 1-18Layers |
Material | FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate |
Surface Finish | HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek) |
Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) |
Copper Thickness | 1/2 oz min;12 oz max |
Solder Mask | Green/Black/White/Red/Blue/Yellow |
Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
Min.Hole Diameter for CNC Driling | 0.1mm(4mil) |
Min.Hole Diameter for punching | 0.9mm(35mil) |
Biggest panel size | 610mm*508mm |
Hole Positon | +/-0.075mm(3mil) CNC Driling |
Conductor Width(W) | 0.05mm(2mil)or; +/-20% of original artwork |
Hole Diameter(H) | PTH L:+/-0.075mm(3mil); Non-PTH L:+/-0.05mm(2mil) |
Outline Tolerance | 0.125mm(5mil) CNC Routing; +/-0.15mm(6mil) by Punching |
Warp & Twist | 0.70% |
Insulation Resistance | 10Kohm-20Mohm |
Conductivity | <50ohm |
Test Voltage | 10-300V |
Panel Size | 110×100mm(min);660×600mm(max) |
Layer-layer misregistration | 4 layers:0.15mm(6mil)max; 6 layers:0.25mm(10mil)max |
Min.spacing between hole edge to circuity pqttern of an inner layer | 0.25mm(10mil) |
Min.spacing between board oulineto circuitry pattern of an inner layer | 0.25mm(10mil) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil); 6 layers:+/-0.15mm(6mil) |
What is PCB soldering?
PCB soldering is another term for the process of soldering
electrical circuit boards. As the soldering iron melts this metal,
it is then used a bit like glue to stick to pieces together. As the
solder metal cools, it will re-harden into one large shape that
connects the two parts.
Our SMT Advantages:
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
PCBA application:
Shenzhen Yideyi Technology Co., Ltd provide a platform for a number of small electronics manufacturers and electromechanical plants on R&D.
FAQ:
Q1. How can we ensure our information should not let third party to
see our design?
We are willing to sign NDA effect by customer side local law and
promising to keep customers date in high confidential level in all
projects.
Q2. What service do you have?
We provide turnkey solution including RD, PCB fabrication, SMT,
final assembly,testing and other value-added service.
Q3. Please note that the following detail will speed up evaluation:
Material:
Board thickness:
Copper thickness:Surface finish:
Solder mask color:
Silkscreen color:
Q4. How about the delivery?
Normally, for sample order, our delivery is about 5 days.For small
batch, our delivery is about 7 days.
For mass production batch, our delivery is about 10 days.
But that depends on the real condition when we get your order.
If your order is urgently please contact us directly ,we will
priority to deal it and do ourbest to give you satisfied delivery
time.
Q5. With payment terms do we accept?
For sample order or small batch, we suggest you to use Pay-pal and
Western Union.For mass production batch, we suggest you to use T/T.
Q6. How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the
function test.Before that, our inspectors will use microscope and
X-ray to check the IC footwelding or bad solder etc.